R&D Magazine just published a really comprehensive review of the Semicon Taiwan 3D Forum. This is a quick read with a lot of great info starting with the major themes of the conference:
- Everyone has bought into the inevitability of 3D ICs, despite the current lack of standards.
- Everyone’s roadmap looks remarkably similar (are we lemmings or are we all on the one true path?).
- Silicon interposers promise to bring “2.5D” assembly quickly to the forefront (a relatively minor jump from PCB “chip on board” assembly).
- The big driver at the moment appears to be wide I/O.
- It’s still not clear who will do the assembly: foundries or assembly houses.
- There don’t seem to be any big technical “stoppers,” just engineering issues to iron out.
This is probably a really good time to remind you that there’s a 3D IC conference taking place next week on December 8-10 next to the San Francisco airport in Burlingame, CA. You have little time to sign up. For more info, click here.
