3D Thursday: A quick look at glass interposers for 3D IC assembly

3D InCites just published a short piece on glass interposers for 3D ICs, as discussed at the 2012 IMAPS International Device Packaging conference, held March 5-8 in Scottsdale, AZ. If you’re interested in seeing a more technical presentation on the topic, see this Webinar presentation slide deck by Dr. Venky Sundaram at Georgia Tech.

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About sleibson2

EDA360 Evangelist and Marketing Director at Cadence Design Systems (blog at http://eda360insider.wordpress.com/)
This entry was posted in 2.5D, 3D, EDA360, Packaging, Silicon Realization and tagged , . Bookmark the permalink.

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