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Recent Posts
- A head-to-head comparison of the ARM Cortex-M4 and –M0 processor cores by Jack Ganssle
- Friday Video: SoC in tiny 500mg backpack transforms cockroach into radio-controlled exploration vehicle
- Friday Video: A different kind of fab with some very, very cool machines
- Friday Video: Get the latest skinny on the IPC-2581 open interchange standard for PCB design
- Smartphones: Where PCIe has not gone before—but will. Sooner rather than later.
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- 39 low-cost boards for embedded Linux application development starting with Raspberry Pi. Want the list?
- Nvidia Tegra 3 based on five ARM Cortex-A9 cores is mobile processor of the year declares Microprocessor Report
- Friday Video: Webcam + Open-source video code + Arduino Uno microcontroller board + pan/tilt servo make automated face-tracker, prove the power of an apps-centric world
- Friday Video: Two more low-cost, ARM-based, embedded-Linux development boards from ODROID and Google
- How about a quick and easy guide to ARM Cortex processor cores? Got one for you from ARM TechCon 2011
- Raspberry Pi + Canon = Camera Pi: ARM 11 and Linux hack of a Canon 5D Mk II DSLR
- 3D Thursday: Altera adds Avago MicroPOD optical interconnects to FPGA package to handle bidirectional 100Gbps Ethernet
- Today’s Apple iPhone 4S intro emphasizes apps. Built-in apps
- Collaboration is key to making DFM work at 28nm and below
- Want a peek at a possible Qualcomm 3D IC roadmap?
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Category Archives: imec
3D Thursday: Lessons learned from the IMEC’s 3D DRAM-on-logic chip design work
I recently covered the groundbreaking WIOMING 3D chip design done by CEA-Imec in conjunction with ST-Ericsson. (See “3D Week: Wide I/O SDRAM, Network on Chip, Multicore, TSV, Asynchronous Logic—3D SoC stack from CEA-Leti and ST-Ericsson hits all the advanced notes. … Continue reading
Cadence collaboration produces TSMC Reference Flow 12.0 and Analog-Mixed-Signal (AMS) Reference Flow v2.0 for 28nm including ESL and 3D TSV DFT support
Today’s the first day of DAC and Cadence is sponsoring a 20nm development panel and lunch at the Omni Hotel adjacent to the San Diego Convention Center. At the same time, Cadence and TSMC have been cooperating on the TSMC … Continue reading
Posted in 3D, AMS, DAC, EDA360, imec, Silicon Realization, TSMC, TSV
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