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Recent Posts
- A head-to-head comparison of the ARM Cortex-M4 and –M0 processor cores by Jack Ganssle
- Friday Video: SoC in tiny 500mg backpack transforms cockroach into radio-controlled exploration vehicle
- Friday Video: A different kind of fab with some very, very cool machines
- Friday Video: Get the latest skinny on the IPC-2581 open interchange standard for PCB design
- Smartphones: Where PCIe has not gone before—but will. Sooner rather than later.
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- 39 low-cost boards for embedded Linux application development starting with Raspberry Pi. Want the list?
- Ingenious architectural features allow ST to extract maximum performance from new microcontroller family based on ARM Cortex-M4. Cost: less than 6 bucks in 1000s
- Today’s Apple iPhone 4S intro emphasizes apps. Built-in apps
- 3D Thursday: Generation-jumping 2.5D Xilinx Virtex-7 2000T FPGA delivers 1,954,560 logic cells using 6.8 BILLION transistors (UPDATED!)
- Friday Video: Webcam + Open-source video code + Arduino Uno microcontroller board + pan/tilt servo make automated face-tracker, prove the power of an apps-centric world
- A head-to-head comparison of the ARM Cortex-M4 and –M0 processor cores by Jack Ganssle
- EDA360 and the brand new Hewlett-Packard 15C Limited Edition RPN pocket scientific calculator
- How about a quick and easy guide to ARM Cortex processor cores? Got one for you from ARM TechCon 2011
- Nvidia Tegra 3 based on five ARM Cortex-A9 cores is mobile processor of the year declares Microprocessor Report
- 3D Thursday: The most expensive RAM in the world
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Tag Archives: 28Gbps
Can 2.5D IC assembly really reduce SoC software-development costs? Gabe Moretti thinks it can
Last week on the EDA Café Web site, EDA Editor and Industry Observer Gabe Moretti discussed my DAC blog post on Wally Rhines’ discussion of software’s role in the rising cost of SoC development. (See “Some chip-design reality from Mentor’s … Continue reading
Posted in 2.5D, 3D, EDA360, SoC, SoC Realization, System Realization
Tagged 2.5D, 28Gbps, Altera, FPGA, software, Virtex 7, Xilinx
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Friday Video + 3D Thursday: Xilinx Virtex-7 H580T uses 3D assembly to merge 28Gbps xceivers, FPGA fabric
The first 3D part in the Xilinx Virtex-7 FPGA family—the 2000T—permitted the construction of a huge FPGA while sidestepping the yield issues of large 28nm die. Now, Xilinx has used 3D IC assembly to meld two FPGA logic slices and … Continue reading
Posted in 2.5D, 28nm, 3D, EDA360, FPGA, Silicon Realization, SoC, SoC Realization, System Realization
Tagged 2.5D, 28Gbps, 3D, H580T, Xilinx
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Amazing Friday Video: Xilinx GTZ SerDes transceivers pump 26Gbps/channel through Luxtera silicon photonics module
Setup for this video is pretty complicated so bear with me. The following video shows a Xilinx test chip with “7 Series GTX” transceivers pumping 26Gbps data over four channels through a stand-alone Luxtera “silicon optics” multichannel transceiver module. The … Continue reading
