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- A head-to-head comparison of the ARM Cortex-M4 and –M0 processor cores by Jack Ganssle
- Friday Video: SoC in tiny 500mg backpack transforms cockroach into radio-controlled exploration vehicle
- Friday Video: A different kind of fab with some very, very cool machines
- Friday Video: Get the latest skinny on the IPC-2581 open interchange standard for PCB design
- Smartphones: Where PCIe has not gone before—but will. Sooner rather than later.
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- 39 low-cost boards for embedded Linux application development starting with Raspberry Pi. Want the list?
- Want a peek at a possible Qualcomm 3D IC roadmap?
- A head-to-head comparison of the ARM Cortex-M4 and –M0 processor cores by Jack Ganssle
- 3D Thursday: Wide I/O and TSVs have a ripple effect on the DRAM controller. Who knew?
- Friday Video: Webcam + Open-source video code + Arduino Uno microcontroller board + pan/tilt servo make automated face-tracker, prove the power of an apps-centric world
- Nvidia Tegra 3 based on five ARM Cortex-A9 cores is mobile processor of the year declares Microprocessor Report
- 3D Week: Wide I/O SDRAM, Network on Chip, Multicore, TSV, Asynchronous Logic—3D SoC stack from CEA-Leti and ST-Ericsson hits all the advanced notes. Can you say “Tour de Force”?
- How Skyera developed the 44Tbyte, enterprise-class Skyhawk SSD from the ground up. A System Realization story.
- Are FinFETs inevitable at 20nm? “Yes, no, maybe” says Professor Chenming Hu
- EDA360 and the brand new Hewlett-Packard 15C Limited Edition RPN pocket scientific calculator
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Tag Archives: 3DIC
3D Thursday (late): Qualcomm’s Riko Radojcic to keynote 3D Friday at EDPS in Monterey, April 6
EDPS—the world’s “best” conference devoted to discussing the processes needed for advanced electronic design—is dedicating its entire second day (Friday, April 6) to 3D IC topics. The just-announced keynote speaker is Riko Radojcic, Director of Design for Silicon Initiatives at … Continue reading
Posted in 2.5D, 3D, EDA360
Tagged 3D, 3DIC, EDPS, Monterey, Monterey California, Qualcomm
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