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- A head-to-head comparison of the ARM Cortex-M4 and –M0 processor cores by Jack Ganssle
- Friday Video: A different kind of fab with some very, very cool machines
- Friday Video: Get the latest skinny on the IPC-2581 open interchange standard for PCB design
- Smartphones: Where PCIe has not gone before—but will. Sooner rather than later.
EDA360 Tag Cloud2.5D 3D 20nm 28nm Altera Analog Android Apple ARM ARM architecture ASIC Cadence Cortex-A15 Cortex-M0 DAC Dave Jones EDA EDPS FinFET Flash FPGA Freescale Freescale Semiconductor GlobalFoundries IBM Intel iPhone Jim Hogan Linux Low Power microcontroller Micron Microsoft Mixed Signal Nvidia Qualcomm Samsung SDRAM SoC STMicroelectronics Texas Instruments TSMC USB verification Xilinx
- 39 low-cost boards for embedded Linux application development starting with Raspberry Pi. Want the list?
- Nvidia Tegra 3 based on five ARM Cortex-A9 cores is mobile processor of the year declares Microprocessor Report
- Xilinx Zynq EPPs based on two ARM Cortex-A9s create a new category that fits in among SoCs, FPGAs, and microcontrollers
- How about a quick and easy guide to ARM Cortex processor cores? Got one for you from ARM TechCon 2011
- Raspberry Pi + Canon = Camera Pi: ARM 11 and Linux hack of a Canon 5D Mk II DSLR
- Freescale starts sampling $0.49 Kinetis L microcontrollers based on ARM Cortex-M0+ processor core
- EDA360 and the brand new Hewlett-Packard 15C Limited Edition RPN pocket scientific calculator
- Friday Video: Two more low-cost, ARM-based, embedded-Linux development boards from ODROID and Google
- Want to know more about the Micron Hybrid Memory Cube (HMC)? How about its terabit/sec data rate?
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Tag Archives: 3M
3D Thursday: Feedback on last week’s blog post about 3M/IBM agreement to work on heat-conductive 3D assembly adhesives
Last Thursday, I wrote a blog entry on the agreement between IBM and 3M to develop advanced adhesives to aid in 3D die-stack assembly and heat removal. (See “3D Thursday: Can IBM and 3M really build a 3D, 100-chip stairway … Continue reading
IBM and 3M have announced a program to develop heat-dissipating adhesives that would permit the construction of tall, 3D “towers” of silicon chips in 3D assemblies. The stated target: 100 stacked chips. Some things about 3D assembly are absolutely uncontroversial: … Continue reading