Tag Archives: 3M

3D Thursday: Feedback on last week’s blog post about 3M/IBM agreement to work on heat-conductive 3D assembly adhesives

Last Thursday, I wrote a blog entry on the agreement between IBM and 3M to develop advanced adhesives to aid in 3D die-stack assembly and heat removal. (See “3D Thursday: Can IBM and 3M really build a 3D, 100-chip stairway … Continue reading

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3D Thursday: Can IBM and 3M really build a 3D, 100-chip stairway to heaven with glue?

IBM and 3M have announced a program to develop heat-dissipating adhesives that would permit the construction of tall, 3D “towers” of silicon chips in 3D assemblies. The stated target: 100 stacked chips. Some things about 3D assembly are absolutely uncontroversial: … Continue reading

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