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Recent Posts
- A head-to-head comparison of the ARM Cortex-M4 and –M0 processor cores by Jack Ganssle
- Friday Video: SoC in tiny 500mg backpack transforms cockroach into radio-controlled exploration vehicle
- Friday Video: A different kind of fab with some very, very cool machines
- Friday Video: Get the latest skinny on the IPC-2581 open interchange standard for PCB design
- Smartphones: Where PCIe has not gone before—but will. Sooner rather than later.
EDA360 Tag Cloud
2.5D 3D 20nm 28nm Altera Analog Android Apple ARM ARM architecture ASIC Cadence Cortex-A15 Cortex-M0 DAC Dave Jones EDA EDPS FinFET Flash FPGA Freescale Freescale Semiconductor GlobalFoundries IBM Intel iPhone Jim Hogan Linux Low Power microcontroller Micron Microsoft Mixed Signal Nvidia Qualcomm Samsung SDRAM SoC STMicroelectronics Texas Instruments TSMC USB verification XilinxTop Posts
- 39 low-cost boards for embedded Linux application development starting with Raspberry Pi. Want the list?
- How about a quick and easy guide to ARM Cortex processor cores? Got one for you from ARM TechCon 2011
- Want a peek at a possible Qualcomm 3D IC roadmap?
- The DDR4 SDRAM spec and SoC design. What do we know now?
- Friday Video: Two more low-cost, ARM-based, embedded-Linux development boards from ODROID and Google
- A head-to-head comparison of the ARM Cortex-M4 and –M0 processor cores by Jack Ganssle
- Friday Video: Webcam + Open-source video code + Arduino Uno microcontroller board + pan/tilt servo make automated face-tracker, prove the power of an apps-centric world
- 3D Thursday: Power is a killer app for TI’s PowerStack 3D packaging—parasitics vanish
- 3D Thursday: More on the Xilinx Virtex 7 with 2.5D tiling. Wave of the future or stopgap measure?
- Agilent knocks one out of the park with new, low-cost line of digital scopes—a very competitive entry into the low-end DSO market and a perfect example of EDA360 design using end-to-end design and apps.
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Tag Archives: Atrenta
3D Thursday: Some unexpected implications of IP subsystems coupled with 3D IC assembly
A new “Experts at the Table” conversation on the Semiconductor Manufacturing and Design Community (SMD) site about IP Subsystems among Kevin Meyer, vice president of design enablement strategy and alliances at GlobalFoundries; Steve Roddy, vice president of marketing at Tensilica; … Continue reading
Posted in 3D, EDA360
Tagged 3D IC, Atrenta, GlobalFoundries, IP Subsystems, Tensilica
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FREE DAC 2012 Exhibit 3-day passes. Limited quantity. Time-limited offer. Get ‘em NOW!
Want to go see the latest EDA offerings on the DAC exhibit floor but you (or your boss) can’t spring for the cash? Bummer. Atrenta, Cadence, and Springsoft feel your pain and once more, the three amigos have partnered to … Continue reading
Friday Video: Atrenta joins the Cadence System Realization Alliance. Customers win
Atrenta announced this week just before ARM TechCon 2011 that it has joined the Cadence System Realization Alliance. The first result of this agreement is to ensure seamless operation of the Atrenta Spyglass platform with the Cadence C-to-Silicon Compiler. Atrenta … Continue reading
