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- Friday Video: Two more low-cost, ARM-based, embedded-Linux development boards from ODROID and Google
- Collaboration is key to making DFM work at 28nm and below
- 3D Thursday: Altera adds Avago MicroPOD optical interconnects to FPGA package to handle bidirectional 100Gbps Ethernet
- TI Stellaris LaunchPad eval board features ARM Cortex-M4F. Intro price: $4.99. Get yours now.
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Tag Archives: CEA-Leti
3D Thursday: CEA-Leti launches Open 3D IC assembly partnership program
ElectroIQ reports that CEA-Leti in Grenoble has just launched an Open 3D IC program to permit companies more open access to the 3D IC assembly technologies developed at the research center. Last December, CEA-Leti and ST-Ericsson made a joint presentation … Continue reading
Posted in 2.5D, 3D, EDA360, Silicon Realization, SoC, SoC Realization, System Realization, Wide I/O
Tagged 3D, 3D IC, CEA-Leti, micro pillar, microbump, ST Ericsson, TSV
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