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Recent Posts
- A head-to-head comparison of the ARM Cortex-M4 and –M0 processor cores by Jack Ganssle
- Friday Video: SoC in tiny 500mg backpack transforms cockroach into radio-controlled exploration vehicle
- Friday Video: A different kind of fab with some very, very cool machines
- Friday Video: Get the latest skinny on the IPC-2581 open interchange standard for PCB design
- Smartphones: Where PCIe has not gone before—but will. Sooner rather than later.
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- 39 low-cost boards for embedded Linux application development starting with Raspberry Pi. Want the list?
- Nvidia Tegra 3 based on five ARM Cortex-A9 cores is mobile processor of the year declares Microprocessor Report
- Friday Video: Webcam + Open-source video code + Arduino Uno microcontroller board + pan/tilt servo make automated face-tracker, prove the power of an apps-centric world
- Friday Video: Two more low-cost, ARM-based, embedded-Linux development boards from ODROID and Google
- How about a quick and easy guide to ARM Cortex processor cores? Got one for you from ARM TechCon 2011
- Raspberry Pi + Canon = Camera Pi: ARM 11 and Linux hack of a Canon 5D Mk II DSLR
- Collaboration is key to making DFM work at 28nm and below
- 3D Thursday: Altera adds Avago MicroPOD optical interconnects to FPGA package to handle bidirectional 100Gbps Ethernet
- Today’s Apple iPhone 4S intro emphasizes apps. Built-in apps
- 3D Thursday: Micron to present Hybrid Memory Cube status at EDPS in Monterey, April 6—there’s a lot of news
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Tag Archives: Cisco
GSA Silicon Summit to highlight cutting-edge IC technologies: 3D IC assembly, FinFETs, and SOI. April 26, Silicon Valley
The Global Semiconductor Alliance (GSA) is sponsoring a half-day event that will drill down into three of the leading-edge IC manufacturing technologies of the coming decade: 3D (and 2.5D) IC assembly, FinFETs (or Tri-gate FETs), and silicon-on-insulator (SOI) substrates. The … Continue reading
Posted in 2.5D, 20nm, 28nm, 32nm, 3D, EDA360, FDSOI, Silicon Realization, SoC, SoC Realization
Tagged Cisco, FinFET, IBM, Intel, Multigate device, STMicroelectronics, Tri-Gate
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How would you like some of Cisco’s SoC implementation secrets? Get them at this ARM TechCon session
You know that doing a hasty or inadequate job at the SoC architectural level will cost you in the implementation schedule. If only you could get a few good tips on how to beef up that architectural design-space exploration. Well, … Continue reading
Posted in EDA360, Silicon Realization, SoC, SoC Realization
Tagged Cisco, design-space exploration, secrets, tips
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LSI Corp to host IC innovation conference and technology showcase in Milpitas next week
On October 5 through 7, LSI Corp will be hosting an IC conference and technology showcase in at the beautiful Crowne Plaza Hotel in suburban Milpitas, just north of San Jose (www.lsi.com/AI-conference). Allow me to especially point you to two … Continue reading
Posted in EDA360, Silicon Realization, SoC Realization, System Realization
Tagged Brocade, Cisco, Infinera, LSI, Memoir Systems, TSMC
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