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Recent Posts
- A head-to-head comparison of the ARM Cortex-M4 and –M0 processor cores by Jack Ganssle
- Friday Video: SoC in tiny 500mg backpack transforms cockroach into radio-controlled exploration vehicle
- Friday Video: A different kind of fab with some very, very cool machines
- Friday Video: Get the latest skinny on the IPC-2581 open interchange standard for PCB design
- Smartphones: Where PCIe has not gone before—but will. Sooner rather than later.
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2.5D 3D 20nm 28nm Altera Analog Android Apple ARM ARM architecture ASIC Cadence Cortex-A15 Cortex-M0 DAC Dave Jones EDA EDPS FinFET Flash FPGA Freescale Freescale Semiconductor GlobalFoundries IBM Intel iPhone Jim Hogan Linux Low Power microcontroller Micron Microsoft Mixed Signal Nvidia Qualcomm Samsung SDRAM SoC STMicroelectronics Texas Instruments TSMC USB verification XilinxTop Posts
- 39 low-cost boards for embedded Linux application development starting with Raspberry Pi. Want the list?
- How about a quick and easy guide to ARM Cortex processor cores? Got one for you from ARM TechCon 2011
- The other shoe drops: Altera introduces SoC FPGA, mates ARM Cortex-A9 dual-core processor complex with FPGA fabric
- A head-to-head comparison of the ARM Cortex-M4 and –M0 processor cores by Jack Ganssle
- Where is the mainstream IC process technology today? 28nm? 40nm? 65nm?
- 3D Thursday: 40G and 100G optical Ethernet—Killer 3D app? Perhaps. Compelling? Definitely.
- Raspberry Pi + Canon = Camera Pi: ARM 11 and Linux hack of a Canon 5D Mk II DSLR
- Xilinx Zynq EPPs based on two ARM Cortex-A9s create a new category that fits in among SoCs, FPGAs, and microcontrollers
- Want to know what’s going to happen at 20nm, 14nm, and beyond? A few answers from Frank Leu of Cadence
- Is 28nm really here? Now? When?
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Tag Archives: CoWoS
3D Thursday: Want to see a closeup of the TSMC 3D IC test vehicle?
Richard Goering just published a detailed blog post about the TSMC 2.5D/3D IC test vehicle, which TSMC is calling CoWoS (Chip on Wafer on Substrate) in his Industry Insights blog. This approach to 3D IC assembly bonds active silicon die … Continue reading
3D Thursday: Practical Approaches to 3-D IC—TSV/Silicon Interposer and Wide IO Implementation From People Who Have Been There, Done That
If you’re like me, you’ve heard more than enough theory about 3D IC assembly and you’re ready to get on with the main event and design something. Want to hear about 3D IC technology that works? Now? Then you will … Continue reading
