Search EDA360 Insider
Hey!!! Subscribe now to the EDA360 Insider!
-
Recent Posts
- A head-to-head comparison of the ARM Cortex-M4 and –M0 processor cores by Jack Ganssle
- Friday Video: SoC in tiny 500mg backpack transforms cockroach into radio-controlled exploration vehicle
- Friday Video: A different kind of fab with some very, very cool machines
- Friday Video: Get the latest skinny on the IPC-2581 open interchange standard for PCB design
- Smartphones: Where PCIe has not gone before—but will. Sooner rather than later.
EDA360 Tag Cloud
2.5D 3D 20nm 28nm Altera Analog Android Apple ARM ARM architecture ASIC Cadence Cortex-A15 Cortex-M0 DAC Dave Jones EDA EDPS FinFET Flash FPGA Freescale Freescale Semiconductor GlobalFoundries IBM Intel iPhone Jim Hogan Linux Low Power microcontroller Micron Microsoft Mixed Signal Nvidia Qualcomm Samsung SDRAM SoC STMicroelectronics Texas Instruments TSMC USB verification XilinxTop Posts
- 39 low-cost boards for embedded Linux application development starting with Raspberry Pi. Want the list?
- The DDR4 SDRAM spec and SoC design. What do we know now?
- A head-to-head comparison of the ARM Cortex-M4 and –M0 processor cores by Jack Ganssle
- Friday Video: Webcam + Open-source video code + Arduino Uno microcontroller board + pan/tilt servo make automated face-tracker, prove the power of an apps-centric world
- How about a quick and easy guide to ARM Cortex processor cores? Got one for you from ARM TechCon 2011
- 3D Thursday: Power is a killer app for TI’s PowerStack 3D packaging—parasitics vanish
- Friday Video: Two more low-cost, ARM-based, embedded-Linux development boards from ODROID and Google
- 3D Thursday: More on the Xilinx Virtex 7 with 2.5D tiling. Wave of the future or stopgap measure?
- Want a peek at a possible Qualcomm 3D IC roadmap?
- Agilent knocks one out of the park with new, low-cost line of digital scopes—a very competitive entry into the low-end DSO market and a perfect example of EDA360 design using end-to-end design and apps.
Download the EDA360 Vision Paper here:
Tag Archives: DIMM
The DDR4 SDRAM spec and SoC design. What do we know now?
DDR4 SDRAM is coming. JEDEC may not have released the final spec yet but Samsung made the first DDR4 memory chip announcement in January of this year—a 2133MHz device built with a 30nm process technology—and Hynix followed suit in April … Continue reading
Posted in EDA360, IP, Silicon Realization, SoC Realization, System Realization, Verification
Tagged DDR4, DIMM, JEDEC, SDRAM, Synchronous dynamic random access memory
Leave a comment


