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- A head-to-head comparison of the ARM Cortex-M4 and –M0 processor cores by Jack Ganssle
- Friday Video: SoC in tiny 500mg backpack transforms cockroach into radio-controlled exploration vehicle
- Friday Video: A different kind of fab with some very, very cool machines
- Friday Video: Get the latest skinny on the IPC-2581 open interchange standard for PCB design
- Smartphones: Where PCIe has not gone before—but will. Sooner rather than later.
EDA360 Tag Cloud2.5D 3D 20nm 28nm Altera Analog Android Apple ARM ARM architecture ASIC Cadence Cortex-A15 Cortex-M0 DAC Dave Jones EDA EDPS FinFET Flash FPGA Freescale Freescale Semiconductor GlobalFoundries IBM Intel iPhone Jim Hogan Linux Low Power microcontroller Micron Microsoft Mixed Signal Nvidia Qualcomm Samsung SDRAM SoC STMicroelectronics Texas Instruments TSMC USB verification Xilinx
- 39 low-cost boards for embedded Linux application development starting with Raspberry Pi. Want the list?
- How about a quick and easy guide to ARM Cortex processor cores? Got one for you from ARM TechCon 2011
- Nvidia Tegra 3 based on five ARM Cortex-A9 cores is mobile processor of the year declares Microprocessor Report
- Want a peek at a possible Qualcomm 3D IC roadmap?
- Ingenious architectural features allow ST to extract maximum performance from new microcontroller family based on ARM Cortex-M4. Cost: less than 6 bucks in 1000s
- Raspberry Pi + Canon = Camera Pi: ARM 11 and Linux hack of a Canon 5D Mk II DSLR
- 3D Thursday: A look at some genuine 3D NAND cells, courtesy of Micron
- 3-processor SoC for digital still cameras incorporates an ARM 1136J-S RISC processor core plus separate image and video processors
- How Skyera developed the 44Tbyte, enterprise-class Skyhawk SSD from the ground up. A System Realization story.
- The DDR4 SDRAM spec and SoC design. What do we know now?
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Tag Archives: DRAM
Want to know why you need to be at Memcon this year? Here’s Denali Software founder Sanjay Srivastava to tell you why: Now go and sign up! It’s a free ticket and includes breakfast, lunch, and some goodies—not to mention … Continue reading
Currently, the JEDEC Wide I/O DRAM specification looks to be the biggest driving force behind the adoption of 3D IC assembly. The 512-bit data maw of a Wide I/O SDRAM provides high bandwidth with low power levels, both excellent arguments … Continue reading
Moore’s Law is not dead but the vital signs have clearly changed. That was the key message I heard from Dr. Subramanian Iyer, Fellow and Chief Technologist at the IBM Systems & Technology Group, during the GSA Silicon Summit held … Continue reading
Last week, I quoted Ann Steffora Mutschler’s article about the information that Micron has revealed about it’s 3D Hybrid Memory Cube. Now that I’ve got the paper Micron presented at last week’s Hot Chips 23 conference, I’d like to explain … Continue reading
Glen Hawk, Vice President of the NAND Solutions Group at Micron, was giving the usual polished corporate keynote presentation at this week’s Flash Memory Summit held in Santa Clara, CA. Suddenly, his level tone of voice changed and he got … Continue reading