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Recent Posts
- A head-to-head comparison of the ARM Cortex-M4 and –M0 processor cores by Jack Ganssle
- Friday Video: SoC in tiny 500mg backpack transforms cockroach into radio-controlled exploration vehicle
- Friday Video: A different kind of fab with some very, very cool machines
- Friday Video: Get the latest skinny on the IPC-2581 open interchange standard for PCB design
- Smartphones: Where PCIe has not gone before—but will. Sooner rather than later.
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- 39 low-cost boards for embedded Linux application development starting with Raspberry Pi. Want the list?
- Want a peek at a possible Qualcomm 3D IC roadmap?
- How about a quick and easy guide to ARM Cortex processor cores? Got one for you from ARM TechCon 2011
- The DDR4 SDRAM spec and SoC design. What do we know now?
- A head-to-head comparison of the ARM Cortex-M4 and –M0 processor cores by Jack Ganssle
- 3D Thursday: Intel Penwell SoC for mobile phones employs POP (package-on-package) LPDDR2 SDRAM to reduce power
- Friday Video: Webcam + Open-source video code + Arduino Uno microcontroller board + pan/tilt servo make automated face-tracker, prove the power of an apps-centric world
- How Skyera developed the 44Tbyte, enterprise-class Skyhawk SSD from the ground up. A System Realization story.
- Welcome to 3D Week: Why is 3D important? Now? The memory wall, heat, and disposable sensors
- Friday Video: Two more low-cost, ARM-based, embedded-Linux development boards from ODROID and Google
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Tag Archives: Fujitsu
Fujitsu adopts Cadence Chip Planning System for worldwide microcontroller design. Why? “It helps us build better chips faster.” Want one?
Fujitsu is one of the world’s top 10 microcontroller vendors. To stay competitive in this crowded, $15 billion market (2011 estimate by Databeans), a microcontroller vendor must freshen its microcontroller offerings at a very rapid pace and any boost in … Continue reading
3D Thursday: Lessons learned from the IMEC’s 3D DRAM-on-logic chip design work
I recently covered the groundbreaking WIOMING 3D chip design done by CEA-Imec in conjunction with ST-Ericsson. (See “3D Week: Wide I/O SDRAM, Network on Chip, Multicore, TSV, Asynchronous Logic—3D SoC stack from CEA-Leti and ST-Ericsson hits all the advanced notes. … Continue reading
Need an ARM-based 32-bit microcontroller? There’s more than a few full houses on offer.
When 17 microcontroller vendors pick your processor architecture, you have a right to sing “Something’s happening here.” Alban Rampon of ARM just published a blog entry titled “ARM Cortex-M—How could you choose your microcontroller?” This blog entry lists 17 semiconductor … Continue reading
3D Thursday: IMEC prototypes 3D chip stack, finds some thermal surprises
Imec and several of its 3D integration partners (Globalfoundries, Intel, Micron, Panasonic, Samsung, TSMC, Fujitsu, Sony, Amkor, and Qualcomm) have fabricated a 3-chip 3D IC stack demonstration prototype with the intent of proving several assembly methods plus electrical characteristics and … Continue reading
Posted in 3D, Silicon Realization, SoC Realization, System Realization, TSMC, TSV
Tagged Amkor, Fujitsu, GlobalFoundries, Imec, Intel, Micron, Panasonic, Qualcomm, Samsung, Sony, TSMC
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