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Recent Posts
- A head-to-head comparison of the ARM Cortex-M4 and –M0 processor cores by Jack Ganssle
- Friday Video: SoC in tiny 500mg backpack transforms cockroach into radio-controlled exploration vehicle
- Friday Video: A different kind of fab with some very, very cool machines
- Friday Video: Get the latest skinny on the IPC-2581 open interchange standard for PCB design
- Smartphones: Where PCIe has not gone before—but will. Sooner rather than later.
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- 39 low-cost boards for embedded Linux application development starting with Raspberry Pi. Want the list?
- Want a peek at a possible Qualcomm 3D IC roadmap?
- A head-to-head comparison of the ARM Cortex-M4 and –M0 processor cores by Jack Ganssle
- How about a quick and easy guide to ARM Cortex processor cores? Got one for you from ARM TechCon 2011
- Nvidia Tegra 3 based on five ARM Cortex-A9 cores is mobile processor of the year declares Microprocessor Report
- The DDR4 SDRAM spec and SoC design. What do we know now?
- Friday Video: Webcam + Open-source video code + Arduino Uno microcontroller board + pan/tilt servo make automated face-tracker, prove the power of an apps-centric world
- 3D Week: Wide I/O SDRAM, Network on Chip, Multicore, TSV, Asynchronous Logic—3D SoC stack from CEA-Leti and ST-Ericsson hits all the advanced notes. Can you say “Tour de Force”?
- Qualcomm renames existing ARM-based Snapdragon mobile application processors and provides future roadmap
- Ingenious architectural features allow ST to extract maximum performance from new microcontroller family based on ARM Cortex-M4. Cost: less than 6 bucks in 1000s
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Tag Archives: H580T
Friday Video + 3D Thursday: Xilinx Virtex-7 H580T uses 3D assembly to merge 28Gbps xceivers, FPGA fabric
The first 3D part in the Xilinx Virtex-7 FPGA family—the 2000T—permitted the construction of a huge FPGA while sidestepping the yield issues of large 28nm die. Now, Xilinx has used 3D IC assembly to meld two FPGA logic slices and … Continue reading
Posted in 2.5D, 28nm, 3D, EDA360, FPGA, Silicon Realization, SoC, SoC Realization, System Realization
Tagged 2.5D, 28Gbps, 3D, H580T, Xilinx
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