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Recent Posts
- A head-to-head comparison of the ARM Cortex-M4 and –M0 processor cores by Jack Ganssle
- Friday Video: SoC in tiny 500mg backpack transforms cockroach into radio-controlled exploration vehicle
- Friday Video: A different kind of fab with some very, very cool machines
- Friday Video: Get the latest skinny on the IPC-2581 open interchange standard for PCB design
- Smartphones: Where PCIe has not gone before—but will. Sooner rather than later.
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2.5D 3D 20nm 28nm Altera Analog Android Apple ARM ARM architecture ASIC Cadence Cortex-A15 Cortex-M0 DAC Dave Jones EDA EDPS FinFET Flash FPGA Freescale Freescale Semiconductor GlobalFoundries IBM Intel iPhone Jim Hogan Linux Low Power microcontroller Micron Microsoft Mixed Signal Nvidia Qualcomm Samsung SDRAM SoC STMicroelectronics Texas Instruments TSMC USB verification XilinxTop Posts
- 39 low-cost boards for embedded Linux application development starting with Raspberry Pi. Want the list?
- A head-to-head comparison of the ARM Cortex-M4 and –M0 processor cores by Jack Ganssle
- Want a peek at a possible Qualcomm 3D IC roadmap?
- Friday Video: Webcam + Open-source video code + Arduino Uno microcontroller board + pan/tilt servo make automated face-tracker, prove the power of an apps-centric world
- How about a quick and easy guide to ARM Cortex processor cores? Got one for you from ARM TechCon 2011
- The DDR4 SDRAM spec and SoC design. What do we know now?
- How Skyera developed the 44Tbyte, enterprise-class Skyhawk SSD from the ground up. A System Realization story.
- Nvidia Tegra 3 based on five ARM Cortex-A9 cores is mobile processor of the year declares Microprocessor Report
- Agilent knocks one out of the park with new, low-cost line of digital scopes—a very competitive entry into the low-end DSO market and a perfect example of EDA360 design using end-to-end design and apps.
- Two more low-cost dev boards based on the ARM Cortex-M4 with 1Mbyte of Flash, 192Kbytes of RAM: $15.57 and up
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Tag Archives: Hynix
3D Thursday: ARM, HP, and SK hynix join Hybrid Memory Cube Consortium (HMCC)
Add ARM, HP, and SK hynix to the growing list of companies in the Hybrid Memory Cube Consortium (HMCC). The three new members join the original founding companies, Micron and Samsung, along with Altera, IBM, Microsoft, Open-Silicon, and Xilinx plus … Continue reading
Posted in 3D, Memory
Tagged Altera, Hybrid Memory Cube, Hynix, IBM, Micron Technology, Microsoft, Open-Silicon, Samsung, Xilinx
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3D Thursday: Six more firms join Sematech 3D initiative
EETimes’ Peter Clarke reports that six more companies have joined the Sematech 3D enablement program. The six new members are: Advanced Semiconductor Engineering Inc. (ASE) Altera Corp Analog Devices Inc. (ADI) LSI Corp On Semiconductor Corp Qualcomm Inc These six … Continue reading


