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Recent Posts
- A head-to-head comparison of the ARM Cortex-M4 and –M0 processor cores by Jack Ganssle
- Friday Video: SoC in tiny 500mg backpack transforms cockroach into radio-controlled exploration vehicle
- Friday Video: A different kind of fab with some very, very cool machines
- Friday Video: Get the latest skinny on the IPC-2581 open interchange standard for PCB design
- Smartphones: Where PCIe has not gone before—but will. Sooner rather than later.
EDA360 Tag Cloud
2.5D 3D 20nm 28nm Altera Analog Android Apple ARM ARM architecture ASIC Cadence Cortex-A15 Cortex-M0 DAC Dave Jones EDA EDPS FinFET Flash FPGA Freescale Freescale Semiconductor GlobalFoundries IBM Intel iPhone Jim Hogan Linux Low Power microcontroller Micron Microsoft Mixed Signal Nvidia Qualcomm Samsung SDRAM SoC STMicroelectronics Texas Instruments TSMC USB verification XilinxTop Posts
- 39 low-cost boards for embedded Linux application development starting with Raspberry Pi. Want the list?
- Nvidia Tegra 3 based on five ARM Cortex-A9 cores is mobile processor of the year declares Microprocessor Report
- Friday Video: Webcam + Open-source video code + Arduino Uno microcontroller board + pan/tilt servo make automated face-tracker, prove the power of an apps-centric world
- How about a quick and easy guide to ARM Cortex processor cores? Got one for you from ARM TechCon 2011
- Friday Video: Two more low-cost, ARM-based, embedded-Linux development boards from ODROID and Google
- Collaboration is key to making DFM work at 28nm and below
- 3D Thursday: Altera adds Avago MicroPOD optical interconnects to FPGA package to handle bidirectional 100Gbps Ethernet
- TI Stellaris LaunchPad eval board features ARM Cortex-M4F. Intro price: $4.99. Get yours now.
- Friday Video: Multi-core ARM CubeStormer II solves Rubik’s Cube in 8 seconds from punching the start button to solved puzzle!
- 3D Thursday: Micron to present Hybrid Memory Cube status at EDPS in Monterey, April 6—there’s a lot of news
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Tag Archives: IBM
3D Thursday: Can IBM and 3M really build a 3D, 100-chip stairway to heaven with glue?
IBM and 3M have announced a program to develop heat-dissipating adhesives that would permit the construction of tall, 3D “towers” of silicon chips in 3D assemblies. The stated target: 100 stacked chips. Some things about 3D assembly are absolutely uncontroversial: … Continue reading
What else can you do with IBM’s 45nm SOI process? More games, the Cell processor, and photonics
Last week, I wrote about IBM’s 45nm SOI process, which is now used in a variety of interesting applications such as the Jeopardy!-playing IBM Watson supercomputer, the soon-to-be-available Nintendo Wii U, and an experimental IBM brain simulator. I wondered what … Continue reading
Posted in EDA360, Silicon Realization
Tagged Cell, IBM, Nintendo Wii, Silicon on insulator, Xbox 360
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What can you do with 45nm SOI? A lot, it turns out
Cadence just published a story about working with IBM on developing advanced Spice-level simulation models for IBM’s advanced SOI (silicon on insulator) IC processes to achieve better correlation between the circuit simulation results and the actual silicon. Now you only … Continue reading
Posted in ARM, EDA360, Silicon Realization
Tagged IBM, Nintendo, SOI, Spice, Watson, Wii
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Friday Video: Everything you wanted to know about double patterning at 20nm and below…but were afraid to ask
Dr. Lars Liebman at IBM gave a very clear talk about the need for double patterning at the 22nm and 14nm nodes while at DAC a couple of months ago. Until EUV is ready for production, which is not expected … Continue reading
Posted in EDA360, Silicon Realization
Tagged 20nm, Double Patterning, IBM, IC lithography
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Google’s planned purchase of Motorola Mobility is a pure EDA360 play: Software drives Hardware
When I told my good friend David Thon that Google’s planned purchase of smartphone maker Motorola Mobility was a pure EDA360 play, he invited me to explain. In simplest terms, EDA360 posits that software now drives hardware in the processor-centric … Continue reading
Posted in Android, Apps, EDA360, Firmware, iOS, System Realization
Tagged Android, Apple, Google, IBM, iPhone, Motorola, Motorola Mobility, Research In Motion
1 Comment
PCI Express takes on Apple/Intel Thunderbolt and 16 Gtransfers/sec at PCI SIG while PCIe Gen 3 starts to power up
Two articles from EETimes give an exciting picture for PCI Express’ short- and long-term future. On the most immediate front, 23 adapter cards and 19 systems from PC and peripheral makers participated in the most recent PCIe Gen 3 plugfests. … Continue reading
Posted in EDA360, Silicon Realization, SoC Realization, System Realization
Tagged Advanced Micro Devices, HP, IBM, Intel, Intel Corporation, PCI Express, PCI SIG
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Are FinFETs inevitable at 20nm? “Yes, no, maybe” says Professor Chenming Hu (Part 2)
Yesterday’s blog entry discussed FinFETs as a way to build advanced-process transistors with reduced leakage and improved performance. (See “Are FinFETs inevitable at 20nm? “Yes, no, maybe” says Professor Chenming Hu (Part 1)“.) There’s another way to eliminate the unwanted … Continue reading
Posted in EDA360, Silicon Realization
Tagged ETSOI, FinFET, IBM, Intel, Soitec, UTBSOI
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3D Thursday: Six more firms join Sematech 3D initiative
EETimes’ Peter Clarke reports that six more companies have joined the Sematech 3D enablement program. The six new members are: Advanced Semiconductor Engineering Inc. (ASE) Altera Corp Analog Devices Inc. (ADI) LSI Corp On Semiconductor Corp Qualcomm Inc These six … Continue reading
ARM’s Cortex-A15: A big step up for the ARM processor architecture. Targeting 32nm and 28nm technology nodes.
Earlier this week Cadence announced that it worked with ARM to develop an implementation methodology for the recently announced, high-end ARM Cortex-A15 processor core, code-named Eagle. The ARM Cortex-A15 processor core has an expanded 40-bit (1Tbyte) memory address space (called … Continue reading
Posted in Apps, ARM, EDA360, System Realization
Tagged GlobalFoundries, IBM, Samsung, STMicroelectronics, TI
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