Search EDA360 Insider
Hey!!! Subscribe now to the EDA360 Insider!
-
Recent Posts
- A head-to-head comparison of the ARM Cortex-M4 and –M0 processor cores by Jack Ganssle
- Friday Video: SoC in tiny 500mg backpack transforms cockroach into radio-controlled exploration vehicle
- Friday Video: A different kind of fab with some very, very cool machines
- Friday Video: Get the latest skinny on the IPC-2581 open interchange standard for PCB design
- Smartphones: Where PCIe has not gone before—but will. Sooner rather than later.
EDA360 Tag Cloud
2.5D 3D 20nm 28nm Altera Analog Android Apple ARM ARM architecture ASIC Cadence Cortex-A15 Cortex-M0 DAC Dave Jones EDA EDPS FinFET Flash FPGA Freescale Freescale Semiconductor GlobalFoundries IBM Intel iPhone Jim Hogan Linux Low Power microcontroller Micron Microsoft Mixed Signal Nvidia Qualcomm Samsung SDRAM SoC STMicroelectronics Texas Instruments TSMC USB verification XilinxTop Posts
- 39 low-cost boards for embedded Linux application development starting with Raspberry Pi. Want the list?
- Nvidia Tegra 3 based on five ARM Cortex-A9 cores is mobile processor of the year declares Microprocessor Report
- Xilinx Zynq EPPs based on two ARM Cortex-A9s create a new category that fits in among SoCs, FPGAs, and microcontrollers
- How about a quick and easy guide to ARM Cortex processor cores? Got one for you from ARM TechCon 2011
- Raspberry Pi + Canon = Camera Pi: ARM 11 and Linux hack of a Canon 5D Mk II DSLR
- Freescale starts sampling $0.49 Kinetis L microcontrollers based on ARM Cortex-M0+ processor core
- EDA360 and the brand new Hewlett-Packard 15C Limited Edition RPN pocket scientific calculator
- Want to know more about the Micron Hybrid Memory Cube (HMC)? How about its terabit/sec data rate?
- Friday Video: SoC in tiny 500mg backpack transforms cockroach into radio-controlled exploration vehicle
- Are FinFETs inevitable at 20nm? “Yes, no, maybe” says Professor Chenming Hu
Download the EDA360 Vision Paper here:
Tag Archives: In-Design
Want to know what’s going to happen at 20nm, 14nm, and beyond? A few answers from Frank Leu of Cadence
Last week at the Global Technology Forum held at the Santa Clara Convention Center in Silicon Valley, Cadence VP of R&D Frank Leu discussed the things we’ve learned about 20nm IC manufacturing, what we are learning about 14nm, and where … Continue reading
Posted in System Realization, EDA360, SoC Realization, Silicon Realization, Globalfoundries, 20nm, Samsung, SoC, 28nm, 14nm
Tagged Samsung, IBM, Cadence, 28nm, 20nm, 14nm, In-Design
2 Comments
