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Recent Posts
- A head-to-head comparison of the ARM Cortex-M4 and –M0 processor cores by Jack Ganssle
- Friday Video: SoC in tiny 500mg backpack transforms cockroach into radio-controlled exploration vehicle
- Friday Video: A different kind of fab with some very, very cool machines
- Friday Video: Get the latest skinny on the IPC-2581 open interchange standard for PCB design
- Smartphones: Where PCIe has not gone before—but will. Sooner rather than later.
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- 39 low-cost boards for embedded Linux application development starting with Raspberry Pi. Want the list?
- Friday Video: Webcam + Open-source video code + Arduino Uno microcontroller board + pan/tilt servo make automated face-tracker, prove the power of an apps-centric world
- Raspberry Pi + Canon = Camera Pi: ARM 11 and Linux hack of a Canon 5D Mk II DSLR
- Nvidia Tegra 3 based on five ARM Cortex-A9 cores is mobile processor of the year declares Microprocessor Report
- Xilinx Zynq EPPs based on two ARM Cortex-A9s create a new category that fits in among SoCs, FPGAs, and microcontrollers
- Itching to try out the Xilinx Zynq-7000 EPP? Ask your doctor if Zedboard is right for you
- Need really big FPGAs? Xilinx will be taking the “3D” route for initial Virtex 7 parts
- Experimental , ultra-low-power 1.2V, 65nm SoC from ST and MIT operates at 82.5MHz (!) maximum, 540KHz at 0.54V
- Friday Video: Two more low-cost, ARM-based, embedded-Linux development boards from ODROID and Google
- Processor Wars: NVIDIA reveals a phantom fifth ARM Cortex-A9 processor core in Kal-El mobile processor IC. Guess why it’s there?
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Tag Archives: Irvine Sensors
3D Thursday (early): Steve’s Improbable History of 3D ICs? Six decades of 3D electronic packaging
Last week at the 9th International SoC Conference in Newport Beach, I moderated a 3D IC panel that did a great job of exploring today’s state of the art for 3D IC development. I will be blogging the presentations made … Continue reading
