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Recent Posts
- A head-to-head comparison of the ARM Cortex-M4 and –M0 processor cores by Jack Ganssle
- Friday Video: SoC in tiny 500mg backpack transforms cockroach into radio-controlled exploration vehicle
- Friday Video: A different kind of fab with some very, very cool machines
- Friday Video: Get the latest skinny on the IPC-2581 open interchange standard for PCB design
- Smartphones: Where PCIe has not gone before—but will. Sooner rather than later.
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- 39 low-cost boards for embedded Linux application development starting with Raspberry Pi. Want the list?
- Want a peek at a possible Qualcomm 3D IC roadmap?
- The DDR4 SDRAM spec and SoC design. What do we know now?
- How about a quick and easy guide to ARM Cortex processor cores? Got one for you from ARM TechCon 2011
- A head-to-head comparison of the ARM Cortex-M4 and –M0 processor cores by Jack Ganssle
- How Skyera developed the 44Tbyte, enterprise-class Skyhawk SSD from the ground up. A System Realization story.
- 3D Thursday: Intel Penwell SoC for mobile phones employs POP (package-on-package) LPDDR2 SDRAM to reduce power
- Friday Video: Webcam + Open-source video code + Arduino Uno microcontroller board + pan/tilt servo make automated face-tracker, prove the power of an apps-centric world
- Welcome to 3D Week: Why is 3D important? Now? The memory wall, heat, and disposable sensors
- Professor Chenming Hu talks FinFETs and FDSOI at the GSA Silicon Summit
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Tag Archives: LSI Corp
Is Low-Power design worth the costs? Live, sort of, from DVCon
Last week at DVCon, Cadence sponsored a low-power-themed lunch with the promise “Earn Your Degree in the Low-Power Arts and Sciences.” The panel consisted of: Qi Wang, technical marketing group director, Cadence Ruggero Castagnetti, distinguished engineer, LSI Corp. Sushma Honnavara … Continue reading
Posted in EDA360, Low Power
Tagged Boradcom, Cadence, LSI Corp, Mentor Graphics, Qualcomm
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Globalfoundries, LSI Corp, and Broadcom help Editorial Director Ed Sperling give the industry a low-power report card. How did we score?
On Wednesday at DAC’s show-floor Pavilion, Low-Power Engineering’s Editorial Director Ed Sperling chaired a panel with the intent of giving the industry a report card on its low-power engineering efforts. Along with Sperling on the Pavilion platform were Andrew Brotman, … Continue reading
Posted in DAC, EDA360, Low Power, Silicon Realization, SoC Realization, System Realization
Tagged Broadcom, GlobalFoundries, LSI Corp
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3D Thursday: Six more firms join Sematech 3D initiative
EETimes’ Peter Clarke reports that six more companies have joined the Sematech 3D enablement program. The six new members are: Advanced Semiconductor Engineering Inc. (ASE) Altera Corp Analog Devices Inc. (ADI) LSI Corp On Semiconductor Corp Qualcomm Inc These six … Continue reading
