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Recent Posts
- A head-to-head comparison of the ARM Cortex-M4 and –M0 processor cores by Jack Ganssle
- Friday Video: SoC in tiny 500mg backpack transforms cockroach into radio-controlled exploration vehicle
- Friday Video: A different kind of fab with some very, very cool machines
- Friday Video: Get the latest skinny on the IPC-2581 open interchange standard for PCB design
- Smartphones: Where PCIe has not gone before—but will. Sooner rather than later.
EDA360 Tag Cloud
2.5D 3D 20nm 28nm Altera Analog Android Apple ARM ARM architecture ASIC Cadence Cortex-A15 Cortex-M0 DAC Dave Jones EDA EDPS FinFET Flash FPGA Freescale Freescale Semiconductor GlobalFoundries IBM Intel iPhone Jim Hogan Linux Low Power microcontroller Micron Microsoft Mixed Signal Nvidia Qualcomm Samsung SDRAM SoC STMicroelectronics Texas Instruments TSMC USB verification XilinxTop Posts
- 39 low-cost boards for embedded Linux application development starting with Raspberry Pi. Want the list?
- Want a peek at a possible Qualcomm 3D IC roadmap?
- The DDR4 SDRAM spec and SoC design. What do we know now?
- A head-to-head comparison of the ARM Cortex-M4 and –M0 processor cores by Jack Ganssle
- How about a quick and easy guide to ARM Cortex processor cores? Got one for you from ARM TechCon 2011
- 3D Thursday: Intel Penwell SoC for mobile phones employs POP (package-on-package) LPDDR2 SDRAM to reduce power
- Friday Video: Webcam + Open-source video code + Arduino Uno microcontroller board + pan/tilt servo make automated face-tracker, prove the power of an apps-centric world
- How Skyera developed the 44Tbyte, enterprise-class Skyhawk SSD from the ground up. A System Realization story.
- Welcome to 3D Week: Why is 3D important? Now? The memory wall, heat, and disposable sensors
- 3D Thursday: A look at some genuine 3D NAND cells, courtesy of Micron
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Tag Archives: LTE
3D Week: Wide I/O SDRAM, Network on Chip, Multicore, TSV, Asynchronous Logic—3D SoC stack from CEA-Leti and ST-Ericsson hits all the advanced notes. Can you say “Tour de Force”?
Yesterday, at the RTI 3D Conference, Pascal Vivet from CEA-Leti and Vincent Guérin from ST-Ericsson unveiled a 3D IC project that represents a real Tour de Force of cutting-edge system technology. The quest starts with a key question: “What’s the … Continue reading
Posted in 3D, ARM, EDA360, Silicon Realization, SoC, SoC Realization, System Realization
Tagged 3D, Cadence, Leti, LTE, Multicore, NoC, ST Ericsson, TSV, Wide I/O
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CNN reviews Droid Bionic 4G handset: “first 4G home run” thanks to some spectacular System Realization
Jonathan Geller over on the CNN Web site has just published a review of the new Motorola Droid Bionic 4G cellular handset. There are two paragraphs in this review that really caught my eye: “The Bionic is the first Verizon … Continue reading
Posted in Android, EDA360, System Realization
Tagged 4G, Android, LTE, Motorola, Motorola Droid Bionic, Verizon
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More on the cost of adding LTE to a mobile phone handset. It’s not “just” $39.75. Add at least $10 for the bigger battery.
Here’s a follow-up to my blog post on the IHS report on the cost of adding LTE to a mobile phone handset. (See “What’s the current cost of adding LTE to a mobile phone? $39.75 says an IHS report.”) I … Continue reading
Posted in EDA360, Silicon Realization, SoC Realization, System Realization
Tagged handset, LTE, mobile phone
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What’s the current cost of adding LTE to a mobile phone? $39.75 says an IHS report.
According to a report published recently by the IHS iSuppli Teardown Analysis Service, it costs nearly $40 to add LTE wireless capability to a mobile phone handset. That’s the conclusion of a teardown report on the HTC Thunderbolt mobile phone, … Continue reading
Posted in EDA360, Silicon Realization, SoC Realization, System Realization
Tagged Apple, HTC Thunderbolt, iPhone, LTE
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Apps-Driven: Microsoft buys Skype for $8.5 billion
The news that Microsoft has closed a deal to buy Skype for $8.5 billion is all over cyberspace this morning. I found out about it here on gigaom.com. I like Om Malik’s analysis of why this deal is going down. … Continue reading
Posted in Apps, EDA360, Silicon Realization, SoC Realization, System Realization
Tagged Facetime, Google Voice, Kinect, LTE, Microsoft, Nokia, Om Malik, Skype, Windows Phone 7
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