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- A head-to-head comparison of the ARM Cortex-M4 and –M0 processor cores by Jack Ganssle
- Friday Video: SoC in tiny 500mg backpack transforms cockroach into radio-controlled exploration vehicle
- Friday Video: A different kind of fab with some very, very cool machines
- Friday Video: Get the latest skinny on the IPC-2581 open interchange standard for PCB design
- Smartphones: Where PCIe has not gone before—but will. Sooner rather than later.
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- 39 low-cost boards for embedded Linux application development starting with Raspberry Pi. Want the list?
- Friday Video: Webcam + Open-source video code + Arduino Uno microcontroller board + pan/tilt servo make automated face-tracker, prove the power of an apps-centric world
- How about a quick and easy guide to ARM Cortex processor cores? Got one for you from ARM TechCon 2011
- 3D Thursday: More on the Xilinx Virtex 7 with 2.5D tiling. Wave of the future or stopgap measure?
- Friday Video: Two more low-cost, ARM-based, embedded-Linux development boards from ODROID and Google
- 3D Thursday: Power is a killer app for TI’s PowerStack 3D packaging—parasitics vanish
- Itching to try out the Xilinx Zynq-7000 EPP? Ask your doctor if Zedboard is right for you
- Freescale starts sampling $0.49 Kinetis L microcontrollers based on ARM Cortex-M0+ processor core
- Xilinx Zynq EPPs based on two ARM Cortex-A9s create a new category that fits in among SoCs, FPGAs, and microcontrollers
- The DDR4 SDRAM spec and SoC design. What do we know now?
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Tag Archives: Monterey
3D Thursday (late): Qualcomm’s Riko Radojcic to keynote 3D Friday at EDPS in Monterey, April 6
EDPS—the world’s “best” conference devoted to discussing the processes needed for advanced electronic design—is dedicating its entire second day (Friday, April 6) to 3D IC topics. The just-announced keynote speaker is Riko Radojcic, Director of Design for Silicon Initiatives at … Continue reading
Posted in 2.5D, 3D, EDA360
Tagged 3D, 3DIC, EDPS, Monterey, Monterey California, Qualcomm
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