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Recent Posts
- A head-to-head comparison of the ARM Cortex-M4 and –M0 processor cores by Jack Ganssle
- Friday Video: SoC in tiny 500mg backpack transforms cockroach into radio-controlled exploration vehicle
- Friday Video: A different kind of fab with some very, very cool machines
- Friday Video: Get the latest skinny on the IPC-2581 open interchange standard for PCB design
- Smartphones: Where PCIe has not gone before—but will. Sooner rather than later.
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- 39 low-cost boards for embedded Linux application development starting with Raspberry Pi. Want the list?
- Want a peek at a possible Qualcomm 3D IC roadmap?
- A head-to-head comparison of the ARM Cortex-M4 and –M0 processor cores by Jack Ganssle
- Qualcomm renames existing ARM-based Snapdragon mobile application processors and provides future roadmap
- How about a quick and easy guide to ARM Cortex processor cores? Got one for you from ARM TechCon 2011
- 3D Week: Wide I/O SDRAM, Network on Chip, Multicore, TSV, Asynchronous Logic—3D SoC stack from CEA-Leti and ST-Ericsson hits all the advanced notes. Can you say “Tour de Force”?
- The DDR4 SDRAM spec and SoC design. What do we know now?
- Nvidia Tegra 3 based on five ARM Cortex-A9 cores is mobile processor of the year declares Microprocessor Report
- Friday Video: Webcam + Open-source video code + Arduino Uno microcontroller board + pan/tilt servo make automated face-tracker, prove the power of an apps-centric world
- How Skyera developed the 44Tbyte, enterprise-class Skyhawk SSD from the ground up. A System Realization story.
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Tag Archives: Open-Silicon
3D Thursday: ARM, HP, and SK hynix join Hybrid Memory Cube Consortium (HMCC)
Add ARM, HP, and SK hynix to the growing list of companies in the Hybrid Memory Cube Consortium (HMCC). The three new members join the original founding companies, Micron and Samsung, along with Altera, IBM, Microsoft, Open-Silicon, and Xilinx plus … Continue reading
Posted in 3D, Memory
Tagged Altera, Hybrid Memory Cube, Hynix, IBM, Micron Technology, Microsoft, Open-Silicon, Samsung, Xilinx
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3D Thursday: Hybrid Memory Cube—wide I/O only more so—gets an industry consortium
Back in August, I wrote about the 3D SDRAM assembly called the Micron Hybrid Memory Cube (HMC, see “Want to know more about the Micron Hybrid Memory Cube (HMC)? How about its terabit/sec data rate?”) and I called it a … Continue reading
Posted in 3D, EDA360, Memory, Samsung, SoC Realization
Tagged Altera, HMC, HMCC, Hybrid Memory Cube, Micron, Open-Silicon, Xilinx
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Open-Silicon’s Naveed Sherwani speaks about the verification crisis in SoC design with unusual clarity
Last month at DAC, Richard Goering interviewed Open-Silicon CEO Naveed Sherwani for ChipEstimate.tv. The main topic was Open-Silicon’s new “on time or on us” chip delivery program but the last few minutes of the 11-minute video interview cover the very … Continue reading
Posted in EDA360, Silicon Realization, SoC Realization, Verification
Tagged Open-Silicon
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How do you get a processor to tape out at 2.4 GHz? Silicon Realization
In the ramp-up to CDNLive! India this week, ASIC- and chip-design house Open-Silicon announced today that it has successfully taped out a processor design that will run at 2.4GHz using the end-to-end Cadence Silicon Realization product line. “We have fine … Continue reading
