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Recent Posts
- A head-to-head comparison of the ARM Cortex-M4 and –M0 processor cores by Jack Ganssle
- Friday Video: SoC in tiny 500mg backpack transforms cockroach into radio-controlled exploration vehicle
- Friday Video: A different kind of fab with some very, very cool machines
- Friday Video: Get the latest skinny on the IPC-2581 open interchange standard for PCB design
- Smartphones: Where PCIe has not gone before—but will. Sooner rather than later.
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2.5D 3D 20nm 28nm Altera Analog Android Apple ARM ARM architecture ASIC Cadence Cortex-A15 Cortex-M0 DAC Dave Jones EDA EDPS FinFET Flash FPGA Freescale Freescale Semiconductor GlobalFoundries IBM Intel iPhone Jim Hogan Linux Low Power microcontroller Micron Microsoft Mixed Signal Nvidia Qualcomm Samsung SDRAM SoC STMicroelectronics Texas Instruments TSMC USB verification XilinxTop Posts
- 39 low-cost boards for embedded Linux application development starting with Raspberry Pi. Want the list?
- A head-to-head comparison of the ARM Cortex-M4 and –M0 processor cores by Jack Ganssle
- Friday Video: Webcam + Open-source video code + Arduino Uno microcontroller board + pan/tilt servo make automated face-tracker, prove the power of an apps-centric world
- Want a peek at a possible Qualcomm 3D IC roadmap?
- How about a quick and easy guide to ARM Cortex processor cores? Got one for you from ARM TechCon 2011
- Nvidia Tegra 3 based on five ARM Cortex-A9 cores is mobile processor of the year declares Microprocessor Report
- How Skyera developed the 44Tbyte, enterprise-class Skyhawk SSD from the ground up. A System Realization story.
- The DDR4 SDRAM spec and SoC design. What do we know now?
- EDA360 and the brand new Hewlett-Packard 15C Limited Edition RPN pocket scientific calculator
- Agilent knocks one out of the park with new, low-cost line of digital scopes—a very competitive entry into the low-end DSO market and a perfect example of EDA360 design using end-to-end design and apps.
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Tag Archives: Sony
3D Thursday (Late): Sony to invest 80 billion Yen in stacked CMOS sensor manufacturing expansion
Quoting a corporate press release, the Web site http://www.dpreview.com reports that Sony Corp intends to invest approximately 80 billion Yen through the end of March, 2014 to expand its capacity to manufacture “stacked silicon sensors,” which are 3D IC assemblies … Continue reading
Posted in 3D, EDA360, Silicon Realization, SoC, SoC Realization
Tagged 3D, backside illumination, Sony, stacked silicon
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3D Thursday: Lessons learned from the IMEC’s 3D DRAM-on-logic chip design work
I recently covered the groundbreaking WIOMING 3D chip design done by CEA-Imec in conjunction with ST-Ericsson. (See “3D Week: Wide I/O SDRAM, Network on Chip, Multicore, TSV, Asynchronous Logic—3D SoC stack from CEA-Leti and ST-Ericsson hits all the advanced notes. … Continue reading
Apple iPhone 4S: How about a peek under the hood?
Friday was the first day to get your hands on an Apple iPhone 4S. I saw a photo in the San Jose Mercury News of Steve “Woz” Wozniak sitting in a lawn chair camped out at a local Apple store. … Continue reading
Posted in EDA360, Mobile, Silicon Realization, SoC, SoC Realization, System Realization
Tagged Apple, Chipworks, IFixit, iPhone, Sony
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3D Thursday: IMEC prototypes 3D chip stack, finds some thermal surprises
Imec and several of its 3D integration partners (Globalfoundries, Intel, Micron, Panasonic, Samsung, TSMC, Fujitsu, Sony, Amkor, and Qualcomm) have fabricated a 3-chip 3D IC stack demonstration prototype with the intent of proving several assembly methods plus electrical characteristics and … Continue reading
Posted in 3D, Silicon Realization, SoC Realization, System Realization, TSMC, TSV
Tagged Amkor, Fujitsu, GlobalFoundries, Imec, Intel, Micron, Panasonic, Qualcomm, Samsung, Sony, TSMC
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Sony jumps into tablet game with flat S1 and clamshell, dual-screen S2 based on Android 3.0
Sony has decided to jump into the tablet pool. Today, the company announced two very different tablet products, code-named the S1 and S2, which are based on the new Android 3.0 operating system. Both tablets will have WiFi and WAN … Continue reading
