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Recent Posts
- A head-to-head comparison of the ARM Cortex-M4 and –M0 processor cores by Jack Ganssle
- Friday Video: SoC in tiny 500mg backpack transforms cockroach into radio-controlled exploration vehicle
- Friday Video: A different kind of fab with some very, very cool machines
- Friday Video: Get the latest skinny on the IPC-2581 open interchange standard for PCB design
- Smartphones: Where PCIe has not gone before—but will. Sooner rather than later.
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- 39 low-cost boards for embedded Linux application development starting with Raspberry Pi. Want the list?
- Nvidia Tegra 3 based on five ARM Cortex-A9 cores is mobile processor of the year declares Microprocessor Report
- Xilinx Zynq EPPs based on two ARM Cortex-A9s create a new category that fits in among SoCs, FPGAs, and microcontrollers
- Raspberry Pi + Canon = Camera Pi: ARM 11 and Linux hack of a Canon 5D Mk II DSLR
- Freescale starts sampling $0.49 Kinetis L microcontrollers based on ARM Cortex-M0+ processor core
- EDA360 and the brand new Hewlett-Packard 15C Limited Edition RPN pocket scientific calculator
- How about a quick and easy guide to ARM Cortex processor cores? Got one for you from ARM TechCon 2011
- 3D Thursday: 40G and 100G optical Ethernet—Killer 3D app? Perhaps. Compelling? Definitely.
- Friday Video: SoC in tiny 500mg backpack transforms cockroach into radio-controlled exploration vehicle
- Want to know more about the Micron Hybrid Memory Cube (HMC)? How about its terabit/sec data rate?
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Tag Archives: sSilicon
3D Thursday: Who is responsible for successful 2.5D and 3D assembly? eSilicon is perhaps saying “Us”
Two weeks ago, I moderated a 3D IC panel at the 9th International SoC Conference in Newport Beach, California. Last week, I wrote about the first two speakers. (See “3D Thursday: Where can you start with 3D?” and “3D Thursday: … Continue reading
Posted in 2.5D, 3D, EDA360, Silicon Realization, SoC, SoC Realization
Tagged 2.5D, 3D, sSilicon, Xilinx
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