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Recent Posts
- A head-to-head comparison of the ARM Cortex-M4 and –M0 processor cores by Jack Ganssle
- Friday Video: SoC in tiny 500mg backpack transforms cockroach into radio-controlled exploration vehicle
- Friday Video: A different kind of fab with some very, very cool machines
- Friday Video: Get the latest skinny on the IPC-2581 open interchange standard for PCB design
- Smartphones: Where PCIe has not gone before—but will. Sooner rather than later.
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2.5D 3D 20nm 28nm Altera Analog Android Apple ARM ARM architecture ASIC Cadence Cortex-A15 Cortex-M0 DAC Dave Jones EDA EDPS FinFET Flash FPGA Freescale Freescale Semiconductor GlobalFoundries IBM Intel iPhone Jim Hogan Linux Low Power microcontroller Micron Microsoft Mixed Signal Nvidia Qualcomm Samsung SDRAM SoC STMicroelectronics Texas Instruments TSMC USB verification XilinxTop Posts
- 39 low-cost boards for embedded Linux application development starting with Raspberry Pi. Want the list?
- 3D Thursday: A look at some genuine 3D NAND cells, courtesy of Micron
- Freescale starts sampling $0.49 Kinetis L microcontrollers based on ARM Cortex-M0+ processor core
- How about a quick and easy guide to ARM Cortex processor cores? Got one for you from ARM TechCon 2011
- 3D Thursday: Power is a killer app for TI’s PowerStack 3D packaging—parasitics vanish
- Nvidia Tegra 3 based on five ARM Cortex-A9 cores is mobile processor of the year declares Microprocessor Report
- The DDR4 SDRAM spec and SoC design. What do we know now?
- Friday Video: Circuit simulation app for Android. SPICE for $10, runs in your hand? Well, almost.
- A head-to-head comparison of the ARM Cortex-M4 and –M0 processor cores by Jack Ganssle
- Raspberry Pi + Canon = Camera Pi: ARM 11 and Linux hack of a Canon 5D Mk II DSLR
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Tag Archives: ST Ericsson
3D Thursday: CEA-Leti launches Open 3D IC assembly partnership program
ElectroIQ reports that CEA-Leti in Grenoble has just launched an Open 3D IC program to permit companies more open access to the 3D IC assembly technologies developed at the research center. Last December, CEA-Leti and ST-Ericsson made a joint presentation … Continue reading
Posted in System Realization, EDA360, SoC Realization, Silicon Realization, 3D, SoC, 2.5D, Wide I/O
Tagged 3D, ST Ericsson, 3D IC, TSV, CEA-Leti, microbump, micro pillar
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3D Week: Wide I/O SDRAM, Network on Chip, Multicore, TSV, Asynchronous Logic—3D SoC stack from CEA-Leti and ST-Ericsson hits all the advanced notes. Can you say “Tour de Force”?
Yesterday, at the RTI 3D Conference, Pascal Vivet from CEA-Leti and Vincent Guérin from ST-Ericsson unveiled a 3D IC project that represents a real Tour de Force of cutting-edge system technology. The quest starts with a key question: “What’s the … Continue reading
Posted in 3D, ARM, EDA360, Silicon Realization, SoC, SoC Realization, System Realization
Tagged 3D, Cadence, Leti, LTE, Multicore, NoC, ST Ericsson, TSV, Wide I/O
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Would you like some ARM Cortex-A15 resources to peruse?
Thanks to LinkedIn ARM Based Group community manager Stephan Cadene, we’ve got several pointers to useful documents describing many aspects of the ARM Cortex-A15 processor core. This is all in preparation for many discussions of the ARM Cortex-A15 processor taking … Continue reading
Posted in Android, ARM, Cortex-A15, Ecosystem, EDA360, IP, Silicon Realization, SoC, SoC Realization, System Realization
Tagged ARM architecture, Broadcom, Cortex-A15, Cortex-A5, Cortex-A8, Cortex-A9, Nvidia, Samsung, ST Ericsson, TechCon, Texas Instruments
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