Search EDA360 Insider
- A head-to-head comparison of the ARM Cortex-M4 and –M0 processor cores by Jack Ganssle
- Friday Video: SoC in tiny 500mg backpack transforms cockroach into radio-controlled exploration vehicle
- Friday Video: A different kind of fab with some very, very cool machines
- Friday Video: Get the latest skinny on the IPC-2581 open interchange standard for PCB design
- Smartphones: Where PCIe has not gone before—but will. Sooner rather than later.
EDA360 Tag Cloud2.5D 3D 3D IC 20nm 28nm 32nm 40nm Agilent Altera AMD Analog Android Apple ARM ARM architecture ARM Cortex-A15 ASIC Broadcom Cadence Canon Cortex Cortex-A15 Cortex-M0 DAC Dave Jones DDR3 DDR4 Double Patterning EDA EDPS Field-programmable gate array FinFET Flash Flash memory FPGA Freescale Freescale Semiconductor GlobalFoundries Google IBM Intel IP iPad iPhone JEDEC Jim Hogan Kinect Linux Low Power Lytro microcontroller Micron Microsoft Mixed Signal Multi-core processor Nvidia OrCAD pcb Printed circuit board Qualcomm Robot Samsung SDRAM Snapdragon SoC STMicroelectronics SystemC Texas Instruments TI TSMC USB verification video Wide I/O Xilinx
- 39 low-cost boards for embedded Linux application development starting with Raspberry Pi. Want the list?
- 3D Week: Wide I/O SDRAM, Network on Chip, Multicore, TSV, Asynchronous Logic—3D SoC stack from CEA-Leti and ST-Ericsson hits all the advanced notes. Can you say “Tour de Force”?
- Raspberry Pi + Canon = Camera Pi: ARM 11 and Linux hack of a Canon 5D Mk II DSLR
- Collaboration is key to making DFM work at 28nm and below
- What can you do with 45nm SOI? A lot, it turns out
- Want a peek at a possible Qualcomm 3D IC roadmap?
- The DDR4 SDRAM spec and SoC design. What do we know now?
- Friday Video: The Easter Egg in the Agilent InfiniiVision 3000 X-Series DSO
- 3D Thursday: Intel Penwell SoC for mobile phones employs POP (package-on-package) LPDDR2 SDRAM to reduce power
- How about a quick and easy guide to ARM Cortex processor cores? Got one for you from ARM TechCon 2011
Download the EDA360 Vision Paper here:
Tag Archives: System-on-a-chip
Meaty new book on Mixed-Signal SoC Design, Verification and Implementation Methodology is nearly ready
Is your current SoC project a mixed-signal design? If not, chances are good that the next one will be. That’s because there’s been an evolution in SoC design from pure digital to analog/mixed-signal (AMS) designs over the past several years … Continue reading
Smart analog/mixed-signal IC designs are—er—smarter. Learn how to stuff a 32-bit ARM Cortex-M core into an AMS design at DAC. Lunch included
In these days of the SoC, one chip has to do it all. That means both analog and digital processing. Now you can get a first-hand look at how successful design teams have integrated ARM Cortex-M processor cores in their … Continue reading
Do you need to improve verification performance for advanced-node SoCs? Learn how on May 14 in Munich.
The state space of a chip grows exponentially every 24 months. That’s the verification corollary to Moore’s Law. Verification engineers tackle the problem with faster simulation but that’s no longer enough. The complete verification cycle includes compilation/elaboration; RTL/gate/SV/e/SystemC mixed-mode simulation; … Continue reading
All ASIC and SoC designs are low-power designs at or below the 45nm node. For that reason alone, the industry has seen the rise of power-intent descriptions to help SoC and Silicon Realization teams develop new chip designs. For the … Continue reading