Search EDA360 Insider
Hey!!! Subscribe now to the EDA360 Insider!
-
Recent Posts
- A head-to-head comparison of the ARM Cortex-M4 and –M0 processor cores by Jack Ganssle
- Friday Video: SoC in tiny 500mg backpack transforms cockroach into radio-controlled exploration vehicle
- Friday Video: A different kind of fab with some very, very cool machines
- Friday Video: Get the latest skinny on the IPC-2581 open interchange standard for PCB design
- Smartphones: Where PCIe has not gone before—but will. Sooner rather than later.
EDA360 Tag Cloud
2.5D 3D 20nm 28nm Altera Analog Android Apple ARM ARM architecture ASIC Cadence Cortex-A15 Cortex-M0 DAC Dave Jones EDA EDPS FinFET Flash FPGA Freescale Freescale Semiconductor GlobalFoundries IBM Intel iPhone Jim Hogan Linux Low Power microcontroller Micron Microsoft Mixed Signal Nvidia Qualcomm Samsung SDRAM SoC STMicroelectronics Texas Instruments TSMC USB verification XilinxTop Posts
- 39 low-cost boards for embedded Linux application development starting with Raspberry Pi. Want the list?
- The DDR4 SDRAM spec and SoC design. What do we know now?
- A head-to-head comparison of the ARM Cortex-M4 and –M0 processor cores by Jack Ganssle
- Friday Video: Webcam + Open-source video code + Arduino Uno microcontroller board + pan/tilt servo make automated face-tracker, prove the power of an apps-centric world
- How about a quick and easy guide to ARM Cortex processor cores? Got one for you from ARM TechCon 2011
- 3D Thursday: Power is a killer app for TI’s PowerStack 3D packaging—parasitics vanish
- Friday Video: Two more low-cost, ARM-based, embedded-Linux development boards from ODROID and Google
- Want a peek at a possible Qualcomm 3D IC roadmap?
- 3D Thursday: More on the Xilinx Virtex 7 with 2.5D tiling. Wave of the future or stopgap measure?
- Agilent knocks one out of the park with new, low-cost line of digital scopes—a very competitive entry into the low-end DSO market and a perfect example of EDA360 design using end-to-end design and apps.
Download the EDA360 Vision Paper here:
Tag Archives: TechCon
Would you like some ARM Cortex-A15 resources to peruse?
Thanks to LinkedIn ARM Based Group community manager Stephan Cadene, we’ve got several pointers to useful documents describing many aspects of the ARM Cortex-A15 processor core. This is all in preparation for many discussions of the ARM Cortex-A15 processor taking … Continue reading
Posted in Android, ARM, Cortex-A15, Ecosystem, EDA360, IP, Silicon Realization, SoC, SoC Realization, System Realization
Tagged ARM architecture, Broadcom, Cortex-A15, Cortex-A5, Cortex-A8, Cortex-A9, Nvidia, Samsung, ST Ericsson, TechCon, Texas Instruments
Leave a comment
Ready to dip a toe into 28nm?
You might be interested in this joint presentation from Samsung and Cadence that discusses the advantages of using the 28nm node for your SoC designs and the challenges you’ll face when doing such a design. The presenters are Ankur Gupta … Continue reading
Want some more details about the Samsung 20nm test chip? Here’s your chance: ARM TechCon 2011 on October 25
Later this month, you have the opportunity of attending the ARM TechCon 2011 conference being held in the Santa Clara Convention Center in California. Tuesday, October 25 is dedicated the many different aspects of advanced to SoC design and the … Continue reading
Posted in 20nm, ARM, EDA360, Samsung, Silicon Realization, SoC Realization
Tagged ARM, Cadence, Samsung, TechCon
Leave a comment
