Search EDA360 Insider
Hey!!! Subscribe now to the EDA360 Insider!
-
Recent Posts
- A head-to-head comparison of the ARM Cortex-M4 and –M0 processor cores by Jack Ganssle
- Friday Video: SoC in tiny 500mg backpack transforms cockroach into radio-controlled exploration vehicle
- Friday Video: A different kind of fab with some very, very cool machines
- Friday Video: Get the latest skinny on the IPC-2581 open interchange standard for PCB design
- Smartphones: Where PCIe has not gone before—but will. Sooner rather than later.
EDA360 Tag Cloud
2.5D 3D 20nm 28nm Altera Analog Android Apple ARM ARM architecture ASIC Cadence Cortex-A15 Cortex-M0 DAC Dave Jones EDA EDPS FinFET Flash FPGA Freescale Freescale Semiconductor GlobalFoundries IBM Intel iPhone Jim Hogan Linux Low Power microcontroller Micron Microsoft Mixed Signal Nvidia Qualcomm Samsung SDRAM SoC STMicroelectronics Texas Instruments TSMC USB verification XilinxTop Posts
- 39 low-cost boards for embedded Linux application development starting with Raspberry Pi. Want the list?
- Ingenious architectural features allow ST to extract maximum performance from new microcontroller family based on ARM Cortex-M4. Cost: less than 6 bucks in 1000s
- Today’s Apple iPhone 4S intro emphasizes apps. Built-in apps
- 3D Thursday: Generation-jumping 2.5D Xilinx Virtex-7 2000T FPGA delivers 1,954,560 logic cells using 6.8 BILLION transistors (UPDATED!)
- How about a quick and easy guide to ARM Cortex processor cores? Got one for you from ARM TechCon 2011
- Friday Video: Webcam + Open-source video code + Arduino Uno microcontroller board + pan/tilt servo make automated face-tracker, prove the power of an apps-centric world
- A head-to-head comparison of the ARM Cortex-M4 and –M0 processor cores by Jack Ganssle
- ARM Cortex-A15—does this processor IP core need a new category…Superstar IP?
- Two more low-cost dev boards based on the ARM Cortex-M4 with 1Mbyte of Flash, 192Kbytes of RAM: $15.57 and up
- EDA360 and the brand new Hewlett-Packard 15C Limited Edition RPN pocket scientific calculator
Download the EDA360 Vision Paper here:
Tag Archives: testability
3D Thursday: Mark LaPedus writes overview of the 3D IC landscape
Briefly noted: Over at the Semiconductor Manufacturing & Design Community, Senior Editor Mark LaPedus has just published an article that’s a good review of the various challenges to 3D IC adoption including: Known good die Testability Design for test Standards … Continue reading
Posted in 2.5D, 3D, EDA360, Silicon Realization, SoC, SoC Realization
Tagged 3D, DFT, IC, testability
Leave a comment
