Search EDA360 Insider
Hey!!! Subscribe now to the EDA360 Insider!
-
Recent Posts
- A head-to-head comparison of the ARM Cortex-M4 and –M0 processor cores by Jack Ganssle
- Friday Video: SoC in tiny 500mg backpack transforms cockroach into radio-controlled exploration vehicle
- Friday Video: A different kind of fab with some very, very cool machines
- Friday Video: Get the latest skinny on the IPC-2581 open interchange standard for PCB design
- Smartphones: Where PCIe has not gone before—but will. Sooner rather than later.
EDA360 Tag Cloud
2.5D 3D 20nm 28nm Altera Analog Android Apple ARM ARM architecture ASIC Cadence Cortex-A15 Cortex-M0 DAC Dave Jones EDA EDPS FinFET Flash FPGA Freescale Freescale Semiconductor GlobalFoundries IBM Intel iPhone Jim Hogan Linux Low Power microcontroller Micron Microsoft Mixed Signal Nvidia Qualcomm Samsung SDRAM SoC STMicroelectronics Texas Instruments TSMC USB verification XilinxTop Posts
- 39 low-cost boards for embedded Linux application development starting with Raspberry Pi. Want the list?
- Friday Video: Two more low-cost, ARM-based, embedded-Linux development boards from ODROID and Google
- 3D Thursday: Power is a killer app for TI’s PowerStack 3D packaging—parasitics vanish
- How about a quick and easy guide to ARM Cortex processor cores? Got one for you from ARM TechCon 2011
- Friday Video: Webcam + Open-source video code + Arduino Uno microcontroller board + pan/tilt servo make automated face-tracker, prove the power of an apps-centric world
- A head-to-head comparison of the ARM Cortex-M4 and –M0 processor cores by Jack Ganssle
- 3D Thursday: More on the Xilinx Virtex 7 with 2.5D tiling. Wave of the future or stopgap measure?
- The DDR4 SDRAM spec and SoC design. What do we know now?
- Want a peek at a possible Qualcomm 3D IC roadmap?
- Agilent knocks one out of the park with new, low-cost line of digital scopes—a very competitive entry into the low-end DSO market and a perfect example of EDA360 design using end-to-end design and apps.
Download the EDA360 Vision Paper here:
Tag Archives: Texas Instruments OMAP
Daniel Nenni at SemiWiki publishes a [very] brief history of the SoC
Daniel Nenni has just posted a very brief history of the SoC, with heavy emphasis on SoCs for mobile products. The emphasis is probably warranted because mobile designs really have driven SoC design for the past decade. One of the … Continue reading
Posted in EDA360, Silicon Realization, SoC, SoC Realization
Tagged Apple, Daniel Nenni, Nvidia Tegra, Qualcomm, Samsung, SemiWiki, Snapdragon, Texas Instruments OMAP
Leave a comment
If Aladdin’s Genie lived in a Computer-on-Module, it might look like the Gumstix Overo
One of the funniest lines in the 1992 animated Disney movie “Aladdin” is when the frenetic blue Genie, voiced by the incredible Robin Williams, describes his situation: “PHENOMENAL COSMIC POWERS; Itty-bitty living space,” referring to his life in a lamp. … Continue reading
Playing poker with applications processors: Can two ARM Cortex-A15 cores beat four ARM Cortex-A9 cores?
One maxim in the multicore biz is that more (processor cores) is better. Is that really true? All the time? “No” says Texas Instruments. In connection with this weeks (MWC) Mobile World Congress neing held in Barcelona, Texas instruments has … Continue reading
Friday Video: Dave Jones’ Amazon Kindle Fire teardown reveals several System Realization secrets
Everyone enjoys a good product teardown and no one does them better than Dave Jones, who publishes the EEVBlog. This week, Dave tore into the new Amazon Kindle Fire tablet and reveals a few juicy tidbits from its system design. … Continue reading
Posted in System Realization
Tagged Amazon Kindle, Amazon Kindle Fire, ARM processor, DDR, Kindle Fire, LPDDR2, OMAP, Texas Instruments OMAP
2 Comments
