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Recent Posts
- A head-to-head comparison of the ARM Cortex-M4 and –M0 processor cores by Jack Ganssle
- Friday Video: SoC in tiny 500mg backpack transforms cockroach into radio-controlled exploration vehicle
- Friday Video: A different kind of fab with some very, very cool machines
- Friday Video: Get the latest skinny on the IPC-2581 open interchange standard for PCB design
- Smartphones: Where PCIe has not gone before—but will. Sooner rather than later.
EDA360 Tag Cloud
2.5D 3D 20nm 28nm Altera Analog Android Apple ARM ARM architecture ASIC Cadence Cortex-A15 Cortex-M0 DAC Dave Jones EDA EDPS FinFET Flash FPGA Freescale Freescale Semiconductor GlobalFoundries IBM Intel iPhone Jim Hogan Linux Low Power microcontroller Micron Microsoft Mixed Signal Nvidia Qualcomm Samsung SDRAM SoC STMicroelectronics Texas Instruments TSMC USB verification XilinxTop Posts
- 39 low-cost boards for embedded Linux application development starting with Raspberry Pi. Want the list?
- Want a peek at a possible Qualcomm 3D IC roadmap?
- How about a quick and easy guide to ARM Cortex processor cores? Got one for you from ARM TechCon 2011
- Friday Video: Webcam + Open-source video code + Arduino Uno microcontroller board + pan/tilt servo make automated face-tracker, prove the power of an apps-centric world
- The DDR4 SDRAM spec and SoC design. What do we know now?
- A head-to-head comparison of the ARM Cortex-M4 and –M0 processor cores by Jack Ganssle
- 3D Thursday: Intel Penwell SoC for mobile phones employs POP (package-on-package) LPDDR2 SDRAM to reduce power
- EDA360 and the brand new Hewlett-Packard 15C Limited Edition RPN pocket scientific calculator
- ARM Cortex-A15—does this processor IP core need a new category…Superstar IP?
- Nvidia Tegra 3 based on five ARM Cortex-A9 cores is mobile processor of the year declares Microprocessor Report
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Tag Archives: TI
3D Thursday (early): Steve’s Improbable History of 3D ICs? Six decades of 3D electronic packaging
Last week at the 9th International SoC Conference in Newport Beach, I moderated a 3D IC panel that did a great job of exploring today’s state of the art for 3D IC development. I will be blogging the presentations made … Continue reading
What’s unique about the new $199 Android-based Amazon Kindle Fire tablet?
Is it the toughened Gorilla-Glass screen? Nope. Is it the dual-core processor? Nope. Is it the “cloud-accelerated” Amazon Silk browser? Nope. Is it the 8-hour battery life? Certainly not. Is it the unified email inbox? Getting warmer. Is it the … Continue reading
Posted in Android, Ecosystem, EDA360, System Realization
Tagged Amazon, Kindle, Kindle Fire, OMAP, TI
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Need an ARM-based 32-bit microcontroller? There’s more than a few full houses on offer.
When 17 microcontroller vendors pick your processor architecture, you have a right to sing “Something’s happening here.” Alban Rampon of ARM just published a blog entry titled “ARM Cortex-M—How could you choose your microcontroller?” This blog entry lists 17 semiconductor … Continue reading
Mashup of the Titans: TI to buy National Semi
Good thing this wasn’t announced on April 1! The Wall Street Journal is reporting that TI intends to buy National Semiconductor for $6.5 billion, $25/share, essentially a 78% premium over today’s closing price for National’s stock. These two semiconductor firms … Continue reading
Friday video: OMAP 5 and the future of user interfaces. Are you ready for your closeup, Mr. Cruise?
Earlier this week, TI introduced its OMAP 5 quad-core platform for mobile multimedia devices. It has four on-chip ARM processor cores, two ARM Cortex-A15 application processors—capable of running at 2GHz each if needed—and two ARM Cortex-M4 cores to handle real-time … Continue reading
ARM’s Cortex-A15: A big step up for the ARM processor architecture. Targeting 32nm and 28nm technology nodes.
Earlier this week Cadence announced that it worked with ARM to develop an implementation methodology for the recently announced, high-end ARM Cortex-A15 processor core, code-named Eagle. The ARM Cortex-A15 processor core has an expanded 40-bit (1Tbyte) memory address space (called … Continue reading
Posted in Apps, ARM, EDA360, System Realization
Tagged GlobalFoundries, IBM, Samsung, STMicroelectronics, TI
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