Search EDA360 Insider
Hey!!! Subscribe now to the EDA360 Insider!
-
Recent Posts
- A head-to-head comparison of the ARM Cortex-M4 and –M0 processor cores by Jack Ganssle
- Friday Video: SoC in tiny 500mg backpack transforms cockroach into radio-controlled exploration vehicle
- Friday Video: A different kind of fab with some very, very cool machines
- Friday Video: Get the latest skinny on the IPC-2581 open interchange standard for PCB design
- Smartphones: Where PCIe has not gone before—but will. Sooner rather than later.
EDA360 Tag Cloud
2.5D 3D 20nm 28nm Altera Analog Android Apple ARM ARM architecture ASIC Cadence Cortex-A15 Cortex-M0 DAC Dave Jones EDA EDPS FinFET Flash FPGA Freescale Freescale Semiconductor GlobalFoundries IBM Intel iPhone Jim Hogan Linux Low Power microcontroller Micron Microsoft Mixed Signal Nvidia Qualcomm Samsung SDRAM SoC STMicroelectronics Texas Instruments TSMC USB verification XilinxTop Posts
- 39 low-cost boards for embedded Linux application development starting with Raspberry Pi. Want the list?
- Nvidia Tegra 3 based on five ARM Cortex-A9 cores is mobile processor of the year declares Microprocessor Report
- Friday Video: Two more low-cost, ARM-based, embedded-Linux development boards from ODROID and Google
- Friday Video: Webcam + Open-source video code + Arduino Uno microcontroller board + pan/tilt servo make automated face-tracker, prove the power of an apps-centric world
- 3D Thursday: Altera adds Avago MicroPOD optical interconnects to FPGA package to handle bidirectional 100Gbps Ethernet
- How about a quick and easy guide to ARM Cortex processor cores? Got one for you from ARM TechCon 2011
- Collaboration is key to making DFM work at 28nm and below
- Want a peek at a possible Qualcomm 3D IC roadmap?
- 3D Thursday: Micron to present Hybrid Memory Cube status at EDPS in Monterey, April 6—there’s a lot of news
- ARM drops Cortex-A7 core on unsuspecting market, devastates low-power SoC and application-processor landscapes. What’s it all mean?
Download the EDA360 Vision Paper here:
Tag Archives: TLM
IEEE Computer Society Lecture—Creating System-On-Chips: Mixing HW & SW Successfully
As soon as we started to incorporate processors on ASICs, thus instantly creating SoCs, hardware/software integration issues became fully intertwined with chip design. Today, we routinely put a dozen or more firmware-driven processing elements on our SoCs so the issues … Continue reading
Latest version of SystemC, IEEE 1666-2011, now supports TLM 2.0
Chocolate and peanut butter go together. So do SystemC and transaction-level modeling. Just not officially. Until now. Earlier this month, the IEEE Standards Board approved a revision to the IEEE 1666 SystemC standard to bring the widely used OSCI (Open … Continue reading
Posted in Design Abstraction, EDA360, SoC Realization, System Realization, SystemC, TLM
Tagged Accellera, EDA, IEEE 1666, OSCI, SoC Realization, SystemC, TLM
Leave a comment
Free Webinar teaches you how to mix C, C++, SystemC, and SystemVerilog verification models within UVM—October 20
Our world is filled with mixed verification models and that fact isn’t going to change soon. If you would like to learn how to efficiently combine mixed verification models to work within the Accelera Universal Verification Methodology (UVM), then there’s … Continue reading
Posted in System Realization, SystemC, UVM, Verification
Tagged Accelera, SystemC, SystemVerilog, TLM, UVM
Leave a comment
An ESL reference flow for TSMC
Yesterday, Richard Goering published a blog about an ESL reference flow, which is now part of Reference Flow 11.0 that TSMC introduced last June. The ESL reference flow is a validated path for high-level descriptions that produces designs through the … Continue reading


