Search EDA360 Insider
Hey!!! Subscribe now to the EDA360 Insider!
-
Recent Posts
- A head-to-head comparison of the ARM Cortex-M4 and –M0 processor cores by Jack Ganssle
- Friday Video: SoC in tiny 500mg backpack transforms cockroach into radio-controlled exploration vehicle
- Friday Video: A different kind of fab with some very, very cool machines
- Friday Video: Get the latest skinny on the IPC-2581 open interchange standard for PCB design
- Smartphones: Where PCIe has not gone before—but will. Sooner rather than later.
EDA360 Tag Cloud
2.5D 3D 20nm 28nm Altera Analog Android Apple ARM ARM architecture ASIC Cadence Cortex-A15 Cortex-M0 DAC Dave Jones EDA EDPS FinFET Flash FPGA Freescale Freescale Semiconductor GlobalFoundries IBM Intel iPhone Jim Hogan Linux Low Power microcontroller Micron Microsoft Mixed Signal Nvidia Qualcomm Samsung SDRAM SoC STMicroelectronics Texas Instruments TSMC USB verification XilinxTop Posts
- 39 low-cost boards for embedded Linux application development starting with Raspberry Pi. Want the list?
- Ingenious architectural features allow ST to extract maximum performance from new microcontroller family based on ARM Cortex-M4. Cost: less than 6 bucks in 1000s
- How about a quick and easy guide to ARM Cortex processor cores? Got one for you from ARM TechCon 2011
- 3D Thursday: Generation-jumping 2.5D Xilinx Virtex-7 2000T FPGA delivers 1,954,560 logic cells using 6.8 BILLION transistors (UPDATED!)
- Today’s Apple iPhone 4S intro emphasizes apps. Built-in apps
- Friday Video: Webcam + Open-source video code + Arduino Uno microcontroller board + pan/tilt servo make automated face-tracker, prove the power of an apps-centric world
- A head-to-head comparison of the ARM Cortex-M4 and –M0 processor cores by Jack Ganssle
- Two more low-cost dev boards based on the ARM Cortex-M4 with 1Mbyte of Flash, 192Kbytes of RAM: $15.57 and up
- EDA360 and the brand new Hewlett-Packard 15C Limited Edition RPN pocket scientific calculator
- How Skyera developed the 44Tbyte, enterprise-class Skyhawk SSD from the ground up. A System Realization story.
Download the EDA360 Vision Paper here:
Tag Archives: TSMC
Is 28nm really here? Now? When?
Last week at the Gartner Semiconductor Briefing held at the Doubletree Hotel in San Jose, Gartner Research Director Sam Wang presented a forecast for the way new IC process technologies will diffuse into the manufacturing mix. The chart he presented … Continue reading
Posted in EDA360, Silicon Realization
Tagged 20nm, 28nm, 40nm, 65nm, Foundry, Gartner, TSMC
Leave a comment
Gartner’s Sam Wang tosses down the 28nm Silicon Realization gauntlet to IC design houses
Sam Wang may have been a Gartner analyst for only six months or so, but he’s already learned how to drop a stunner on the audience. The event was today’s Gartner Semiconductor briefing at the San Jose Doubletree Hotel near … Continue reading
Posted in EDA360, Silicon Realization, SoC Realization
Tagged 20nm, 28nm, Foundry, Gartner, GlobalFoundries, TSMC
Leave a comment
3D Thursday: MEMS is yet another kind of 3D. EDA entrepreneur Jim Hogan speaks about MEMs.
Yesterday, Cadence hosted a mini conference on MEMS (microelectromechanical systems) with MEMS EDA vendor Coventor. EDA Investor and industry gadabout Jim Hogan gave the keynote and Coventor VP of engineering Steve Breit filled the audience in on some technical details. … Continue reading
Posted in 3D, EDA360, Silicon Realization, System Realization
Tagged Jim Hogan, MEMS, Microelectromechanical systems, TSMC
Leave a comment
3D Thursday: Intel and FinFETs (Tri-Gate transistors)—a different kind of 3D
Earlier this month, Intel announced that it will be using Tri-Gate transistors (FinFETs) to build microprocessors at the 22nm process node. The microprocessor is code-named “Ivy Bridge.” It will be a 22nm version of the company’s Sandy Bridge processor and … Continue reading
Posted in 3D, EDA360, Low Power, Silicon Realization, SoC Realization
Tagged 22nm, FinFET, Intel, Ivy Bridge, Sandy Bridge, Tri-Gate, TSMC
3 Comments
Chairman and CEO Morris Chang provides a semiconductor industry view of 28nm, 3D, and market drivers at TSMC’s Technology Day
EETimes’ Mark LaPedus has just published an article covering today’s remarks made by TSMC’s Chairman and CEO Morris Chang at the company’s Technology Day. Among the most significant ones in my opinion: PCs and then cell phones have been the … Continue reading
Daniel Nenni’s 100th blog. (It’s about TSMC, no surprise)—Congratulations to Daniel
Strategic Foundry Relationship expert and industry blogger Daniel Nenni has just published the hundredth entry in his Silicon Valley Blog. The topic is TSMC’s recent conference and Nenni, who writes a lot about TSMC, dishes up some cogent analysis and … Continue reading
System Realization: Free Webinars. Everyone likes them.
EDA360 defines System Realization as the development of complete hardware/software platforms ready for applications development even before the chip is designed. Cadence offers many free Webinars—both live and archived—that you might find useful. Here are a few Webinars related to … Continue reading
Posted in EDA360, System Realization
Tagged ARM, Cadence, Calypto, CircuitSutra, Imperas, TSMC, Webinar, XtremeEDA
Leave a comment
LSI Corp to host IC innovation conference and technology showcase in Milpitas next week
On October 5 through 7, LSI Corp will be hosting an IC conference and technology showcase in at the beautiful Crowne Plaza Hotel in suburban Milpitas, just north of San Jose (www.lsi.com/AI-conference). Allow me to especially point you to two … Continue reading
Posted in EDA360, Silicon Realization, SoC Realization, System Realization
Tagged Brocade, Cisco, Infinera, LSI, Memoir Systems, TSMC
Leave a comment
An ESL reference flow for TSMC
Yesterday, Richard Goering published a blog about an ESL reference flow, which is now part of Reference Flow 11.0 that TSMC introduced last June. The ESL reference flow is a validated path for high-level descriptions that produces designs through the … Continue reading
