Semico report lists the six biggest issues challenging ASIC and IC design today. Do you agree?

Yesterday, I wrote a blog post about Semico’s Rich Wawrzyniak’s excellent report on IP Subsystems. Today, I thought I’d extract the six key issues he sees as facing the ASIC and IC design community today, to see if you agree. The six top issues are:

  • Rising design costs
  • Increasing design complexity
  • Shrinking market windows
  • Lengthening design cycle times
  • Rapidly changing marketing requirements
  • Escalating integration costs for semiconductor IP blocks

Do you agree with this list? How about the order? Which ones are biting you?

About sleibson2

EDA360 Evangelist and Marketing Director at Cadence Design Systems (blog at https://eda360insider.wordpress.com/)
This entry was posted in EDA360, Silicon Realization, SoC Realization. Bookmark the permalink.

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