More on IP Subsystems from Semico’s IP report

Last week, I wrote about the concept of IP Subsystems as described in Rich Wawrzyniak’s Semico report on IP Subsystems (see “Are IP subsystems the next big IP category?“) This report also notes that many IDMs (integrated device manufacturers) are already using IP Subsystems in shipping silicon. The list of such IDMs is a “Who’s Who” of leading silicon vendors and includes:

  • Intel
  • Qualcomm
  • Samsung
  • NEC
  • NXP
  • Panasonic
  • Mediatek
  • Texas Instruments
  • ST Microelectronics
  • Broadcom
  • Toshiba
  • IBM
  • Chips and Media
  • Sony

The report goes further, saying that most of the top 50 semiconductor companies are using IP Subsystems in their designs and that the existing familiarity with the concept will help to pave the way for commercial 3rd party IP Subsystems in the future.

About sleibson2

EDA360 Evangelist and Marketing Director at Cadence Design Systems (blog at https://eda360insider.wordpress.com/)
This entry was posted in EDA360, SoC Realization. Bookmark the permalink.

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