The last word on IP Subsystems from Semico: Where are they going?

Over the past couple of weeks, I’ve extracted bits of information about IP subsystems from Semico’s recent report on the topic. This blog post is my last of this series and it deals with one interesting tidbit lodged way in the back of the report. Over the 5-year period from 2010 to 2015, the report forecasts that “the Americas” will continue to be the largest consumer of IP Subsystems. However, says the report, the Asia-Pacific region will become the largest consumer by 2015.


That says something significant that reaches far beyond the topic of IP Subsystems and the report confirms the implication: “This is due to the increase in the number of designs that are being done in Asia Pacific and China…”

It will take a high growth rate in both the design of ASICs and the use of IP Subsystems in the Asia-Pacific region and in China to make this happen. The report confirms that this is precisely what’s expected to happen because of “The large numbers of consumers in the China and Asia Pacific regions, and their desire to participate in the communications and consumer revolutions…”

If you’d like to review the other blog posts covering this report, they are:

About sleibson2

EDA360 Evangelist and Marketing Director at Cadence Design Systems (blog at
This entry was posted in EDA360, IP, SoC Realization. Bookmark the permalink.

Leave a Reply

Fill in your details below or click an icon to log in: Logo

You are commenting using your account. Log Out /  Change )

Google photo

You are commenting using your Google account. Log Out /  Change )

Twitter picture

You are commenting using your Twitter account. Log Out /  Change )

Facebook photo

You are commenting using your Facebook account. Log Out /  Change )

Connecting to %s