3D Thursday: Six more firms join Sematech 3D initiative

Posted on April 28, 2011 by

EETimes’ Peter Clarke reports that six more companies have joined the Sematech 3D enablement program. The six new members are:

  • Advanced Semiconductor Engineering Inc. (ASE)
  • Altera Corp
  • Analog Devices Inc. (ADI)
  • LSI Corp
  • On Semiconductor Corp
  • Qualcomm Inc

These six companies joint the existing seven member companies:

  • Globalfoundries
  • Hewlett Packard
  • Hynix
  • IBM
  • Intel
  • Samsung
  • UMC
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About sleibson2

EDA360 Evangelist and Marketing Director at Cadence Design Systems (blog at https://eda360insider.wordpress.com/)
This entry was posted in 3D, EDA360, Silicon Realization, SoC Realization, System Realization and tagged , , , , , , , , , , , , . Bookmark the permalink.

One Response to 3D Thursday: Six more firms join Sematech 3D initiative

  1. Dean Stevens says:
    April 29, 2011 at 12:47 pm

    Hi Steve- It looks like SEMATECH has assembled an august group of companies. I wonder if they’ll be able to work together well enough to actually accomplish something meaningful soon enough to make a difference.

    Reply

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