3D Thursday: Six more firms join Sematech 3D initiative

Posted on April 28, 2011 by

EETimes’ Peter Clarke reports that six more companies have joined the Sematech 3D enablement program. The six new members are:

  • Advanced Semiconductor Engineering Inc. (ASE)
  • Altera Corp
  • Analog Devices Inc. (ADI)
  • LSI Corp
  • On Semiconductor Corp
  • Qualcomm Inc

These six companies joint the existing seven member companies:

  • Globalfoundries
  • Hewlett Packard
  • Hynix
  • IBM
  • Intel
  • Samsung
  • UMC
Advertisements

About sleibson2

EDA360 Evangelist and Marketing Director at Cadence Design Systems (blog at https://eda360insider.wordpress.com/)
This entry was posted in 3D, EDA360, Silicon Realization, SoC Realization, System Realization and tagged , , , , , , , , , , , , . Bookmark the permalink.

One Response to 3D Thursday: Six more firms join Sematech 3D initiative

  1. Dean Stevens says:
    April 29, 2011 at 12:47 pm

    Hi Steve- It looks like SEMATECH has assembled an august group of companies. I wonder if they’ll be able to work together well enough to actually accomplish something meaningful soon enough to make a difference.

    Reply

Leave a Reply

Fill in your details below or click an icon to log in:

Gravatar
WordPress.com Logo

You are commenting using your WordPress.com account. ( Log Out / Change )

Twitter picture

You are commenting using your Twitter account. ( Log Out / Change )

Facebook photo

You are commenting using your Facebook account. ( Log Out / Change )

Google+ photo

You are commenting using your Google+ account. ( Log Out / Change )

Cancel

Connecting to %s