3D Thursday: Six more firms join Sematech 3D initiative

EETimes’ Peter Clarke reports that six more companies have joined the Sematech 3D enablement program. The six new members are:

  • Advanced Semiconductor Engineering Inc. (ASE)
  • Altera Corp
  • Analog Devices Inc. (ADI)
  • LSI Corp
  • On Semiconductor Corp
  • Qualcomm Inc

These six companies joint the existing seven member companies:

  • Globalfoundries
  • Hewlett Packard
  • Hynix
  • IBM
  • Intel
  • Samsung
  • UMC

About sleibson2

EDA360 Evangelist and Marketing Director at Cadence Design Systems (blog at https://eda360insider.wordpress.com/)
This entry was posted in 3D, EDA360, Silicon Realization, SoC Realization, System Realization and tagged , , , , , , , , , , , , . Bookmark the permalink.

One Response to 3D Thursday: Six more firms join Sematech 3D initiative

  1. Dean Stevens says:

    Hi Steve- It looks like SEMATECH has assembled an august group of companies. I wonder if they’ll be able to work together well enough to actually accomplish something meaningful soon enough to make a difference.

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