TheEDA360 Evangelist (and EDA360 Insider blogger) was at the DAC360 video booth today with EETimes’ Brian Fuller. Here are some video survival tips and industry overviews on video.
Search EDA360 Insider
Hey!!! Subscribe now to the EDA360 Insider!
-
Recent Posts
- A head-to-head comparison of the ARM Cortex-M4 and –M0 processor cores by Jack Ganssle
- Friday Video: SoC in tiny 500mg backpack transforms cockroach into radio-controlled exploration vehicle
- Friday Video: A different kind of fab with some very, very cool machines
- Friday Video: Get the latest skinny on the IPC-2581 open interchange standard for PCB design
- Smartphones: Where PCIe has not gone before—but will. Sooner rather than later.
EDA360 Tag Cloud
- 2.5D
- 3D
- 3D IC
- 20nm
- 28nm
- 32nm
- 40nm
- Agilent
- Altera
- AMD
- Analog
- Android
- Apple
- ARM
- ARM architecture
- ARM Cortex-A15
- ASIC
- Broadcom
- Cadence
- Canon
- Cortex
- Cortex-A15
- Cortex-M0
- DAC
- Dave Jones
- DDR3
- DDR4
- Double Patterning
- EDA
- EDPS
- Field-programmable gate array
- FinFET
- Flash
- Flash memory
- FPGA
- Freescale
- Freescale Semiconductor
- GlobalFoundries
- IBM
- Intel
- IP
- iPad
- iPhone
- JEDEC
- Jim Hogan
- Kinect
- Linux
- Low Power
- Lytro
- microcontroller
- Micron
- Microsoft
- Mixed Signal
- Multi-core processor
- Nvidia
- OrCAD
- pcb
- Printed circuit board
- Qualcomm
- Robot
- Samsung
- SDRAM
- Snapdragon
- SoC
- STMicroelectronics
- SystemC
- Texas Instruments
- TI
- TSMC
- USB
- verification
- video
- Wide I/O
- Xilinx
Top Posts
- A head-to-head comparison of the ARM Cortex-M4 and –M0 processor cores by Jack Ganssle
- The DDR4 SDRAM spec and SoC design. What do we know now?
- Who wants more technical detail on the Altera SoC FPGA? Altera says…you!
- 3D Thursday (early): Steve’s Improbable History of 3D ICs? Six decades of 3D electronic packaging
- ARM furthers its “cover the earth” strategy with introduction of R5 and R7 core variants for fast, real-time, deterministic SoC applications
- ARM adds ARM Cortex-A15 and Cortex-R5 models to Fast Models 6.1 release, making these cores immediately available to System Realization teams
- 3D Thursday: CEA-Leti launches Open 3D IC assembly partnership program
Download the EDA360 Vision Paper here:
EDA360 Insider 