A number of manufacturing issues specific to 20nm pose a challenge to developing high-quality silicon and SoCs on time and on budget. Silicon Realization at such an advanced node requires a holistic approach consisting of three critical and interrelated components: unified design intent, higher levels of design abstraction, and design convergence at each stage of the flow. This approach, coupled with new lithography techniques and in-design DFM technologies, provides the most practical and predictable path to 20nm silicon.
If you need to be on the cutting edge of Silicon Realization to be competitive, here’s a brand new, just-finished-today White Paper to introduce you to some of the issues surrounding 20nm design and with some answers to the questions of how to deal with these issues:
EDA360 Insider 