3D Thursday: Hybrid Memory Cube—wide I/O only more so—gets an industry consortium

Back in August, I wrote about the 3D SDRAM assembly called the Micron Hybrid Memory Cube (HMC, see “Want to know more about the Micron Hybrid Memory Cube (HMC)? How about its terabit/sec data rate?”) and I called it a “killer app” for 3D IC assembly. Last week, founding members Micron and Samsung announced the Hybrid Memory Cube Consortium (HMCC) dedicated to expanding “the capabilities of the next generation of memory-based solutions.” Current “Developer Member” companies include Altera, Micron, Open-Silicon, Samsung, and Xilinx. Although the technology scales down memory, the goals of the group are not scaled down at all:

“With performance levels that break through the memory wall, Hybrid Memory Cube represents the key to extending network system performance to push through the challenges of new 100G and 400G infrastructure growth.  Eventually, HMC will drive exascale CPU system performance growth for next generation HPC systems.”

About sleibson2

EDA360 Evangelist and Marketing Director at Cadence Design Systems (blog at https://eda360insider.wordpress.com/)
This entry was posted in 3D, EDA360, Memory, Samsung, SoC Realization and tagged , , , , , , . Bookmark the permalink.

Leave a Reply

Fill in your details below or click an icon to log in:

WordPress.com Logo

You are commenting using your WordPress.com account. Log Out / Change )

Twitter picture

You are commenting using your Twitter account. Log Out / Change )

Facebook photo

You are commenting using your Facebook account. Log Out / Change )

Google+ photo

You are commenting using your Google+ account. Log Out / Change )

Connecting to %s