3D Thursday: A busy week coming up for 3D ICs

This is a very busy week for 3D in the world of the EDA360 Insider. I am about to board a plane for John Wayne Airport to attend an IEEE workshop on 3D IC assembly. Next Monday, there’s a meeting on 3D assembly associated with the Global Semiconductor Alliance and on Tuesday and Wednesday of next week, the Research Triangle Institute is holding a conference about 3D IC assembly in Burlingame, CA. I will try to bring you as much information as possible from these three events.

About sleibson2

EDA360 Evangelist and Marketing Director at Cadence Design Systems (blog at https://eda360insider.wordpress.com/)
This entry was posted in 2.5D, 3D, EDA360, Silicon Realization, SoC, SoC Realization, System Realization and tagged , . Bookmark the permalink.

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