EDPS 3D Friday (April 6) expands with new speakers including 3D IC assembly and packaging advocate Phil Marcoux

Phil Marcoux

I’ve written previously about the all-3D IC design, assembly, and packaging program that will take place during the second day of the EDPS (Electronic Design Process Symposium) workshop in Monterey. This blog post is to let you know that additional speakers have joined the schedule including 3D IC advocate and semiconductor packaging guru Phil Marcoux (he is the 2.5D Working Subgroup Chair at the Global Semiconductor Alliance (GSA) and was named the “Father of Surface Mount Technology” in the US by the IPC in 2007). These speakers are so new to the program, they don’t yet appear on the EDPS Web site, but they’re coming to the event nevertheless.

This “3D Friday” event, part of the 2-day EDPS workshop, is going to be a truly significant event for anyone interested in learning about the state of 3D IC design, assembly, and packaging and for anyone looking to network with the people most closely involved with 3D IC design.

However, you have only until March 18 to get in on the early-bird discount, so you need to register now. Also, the hotel reservation window has been extended so you can still get in on that too. If you hurry.

For more information, click here.

About sleibson2

EDA360 Evangelist and Marketing Director at Cadence Design Systems (blog at https://eda360insider.wordpress.com/)
This entry was posted in 2.5D, 3D, EDA360, Silicon Realization, SoC, SoC Realization, System Realization and tagged , , . Bookmark the permalink.

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