3D Thursday: 3D IC success stories—a DAC panel. June 7

What better way to understand the realities of 3D IC assembly than to listen to the pioneers who have already taken the arrows so you won’t have to? That’s the topic of the upcoming DAC panel: “Is 3-D Ready for the Next Level?” The following pioneers from leading semiconductor device, foundry, and EDA vendors are ready to tell you their stories:

  • Subramanian S. Iyer – IBM Corp., Fishkill, NY
  • Shekhar Borkar – Intel Corp., Hillsboro, OR
  • A.J. Incorvaia – Cadence Design Systems, Inc., Chelmsford, MA
  • Liam Madden – Xilinx, Inc., San Jose, CA
  • Suk Lee – Taiwan Semiconductor Manufacturing Co., Ltd., San Jose, CA


More info here.



About sleibson2

EDA360 Evangelist and Marketing Director at Cadence Design Systems (blog at https://eda360insider.wordpress.com/)
This entry was posted in 2.5D, 3D, EDA360, Silicon Realization and tagged , , , , , , , . Bookmark the permalink.

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