3D Thursday: Practical Approaches to 3-D IC—TSV/Silicon Interposer and Wide IO Implementation From People Who Have Been There, Done That

If you’re like me, you’ve heard more than enough theory about 3D IC assembly and you’re ready to get on with the main event and design something. Want to hear about 3D IC technology that works? Now? Then you will definitely want to sit in on one of the three June 4 DAC 3D Tutorials titled “Enough Talk! Practical Approaches to 3-D IC—TSV/Silicon Interposer and Wide IO Implementation From People Who Have Been There and Done That.” You will not hear about theory or listen to any more forecasts in this tutorial. You will hear about stuff that works—is working already—at TSMC. That’s the only way this tutorial can promise that you will learn what you need to know to be successful in your first 3D design project.

The tutorial presenters are Frank Lee from TSMC and Mark Greenberg from Cadence. TSMC and Cadence have been collaborating for a while on 3D IC design and manufacturing and it’s time you got the benefits from this collaboration. More information on the tutorial here.

About sleibson2

EDA360 Evangelist and Marketing Director at Cadence Design Systems (blog at https://eda360insider.wordpress.com/)
This entry was posted in 2.5D, 3D, Packaging, Silicon Realization, TSMC and tagged , , , , , . Bookmark the permalink.

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