3D Thursday: Electronics Component and Technologies Conference in San Diego features several 3D learning opportunities. May 29-June 1.

The Electronics Component and Technologies Conference being held in San Diego on May 29-June 1 will provide you with several significant opportunities to come up to speed on 3D IC assembly and related topics including:

In addition, there are several 3D professional courses being given on May 29 including:

  • 3D INTEGRATION: ALTERNATIVE TO CONTINUED SCALING by Philip Garrou – Microelectronic Consultants of NC
  • TECHNOLOGY ADVANCES IN 3D-TSV INTEGRATION AND PACKAGING OF MICRO-NANOSYSTEMS by James J.Q. Lu – Rensselaer Polytechnic Institute
  • 3D IC PACKAGING & INTEGRATION AND 3D SI INTEGRATION by John Lau – Industrial Technology Research Institute
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About sleibson2

EDA360 Evangelist and Marketing Director at Cadence Design Systems (blog at https://eda360insider.wordpress.com/)
This entry was posted in 2.5D, 3D, EDA360, Packaging, Silicon Realization, SoC, SoC Realization, System Realization and tagged , , , . Bookmark the permalink.

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