The first 3D part in the Xilinx Virtex-7 FPGA family—the 2000T—permitted the construction of a huge FPGA while sidestepping the yield issues of large 28nm die. Now, Xilinx has used 3D IC assembly to meld two FPGA logic slices and a high-Gbps multi-transceiver die into another part: the Virtex-7 H580T. The result is a 3D device with 870K logic cells, as many as sixteen 28Gbps serial transceivers, and as many as seventy two 13Gbps transceivers.
Here’s a graphic showing how the two FPGA logic slices and the transceiver die attach to the silicon interposer that acts as the substrate for the Xilinx Virtex-7 H580T.
And here’s a video that explains a lot of what’s going on in this product and how 3D IC assembly helps:
For more information on the Xilinx Virtex-7 2000T, see “Generation-jumping 2.5D Xilinx Virtex-7 2000T FPGA delivers 1,954,560 logic cells, consumes only 20W”
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