3D Thursday: ARM, HP, and SK hynix join Hybrid Memory Cube Consortium (HMCC)

Add ARM, HP, and SK hynix to the growing list of companies in the Hybrid Memory Cube Consortium (HMCC). The three new members join the original founding companies, Micron and Samsung, along with Altera, IBM, Microsoft, Open-Silicon, and Xilinx plus a host of Adopter companies including Cadence. For more information on this announcement, see my post in the Denali Memory Report: “ARM, HP, and SK hynix join Hybrid Memory Cube Consortium (HMCC). First spec due by end of year

About sleibson2

EDA360 Evangelist and Marketing Director at Cadence Design Systems (blog at https://eda360insider.wordpress.com/)
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