3D Thursday: What the Cadence purchase of signal- and power-integrity EDA toolmaker Sigrity means for 2.5D and 3D IC assembly

Richard Goering has just published an in-depth analysis in his Industry Insights blog that explains what the Cadence purchase of signal- and power-integrity EDA toolmaker Sigrity means for pcb and IC package designers. Goering quotes Brad Griffin, product marketing director for PCB and IC packaging at Cadence:

“I think we can expand the Sigrity user space to more EE generalists and not just serve experts who are responsible for a final signoff solution.”

So why write this up for 3D Thursday in the EDA360 Insider? Because Goering writes this late in his article:

“Griffin… said that the Sigrity technology will be useful for 2.5D silicon interposer packaging, and that ‘we believe the technology should be applicable’ to 3D die stacks.”

To read Richard Goering’s full blog post, see “Why Cadence Bought Sigrity – And How it May Change PCB Analysis.”

About sleibson2

EDA360 Evangelist and Marketing Director at Cadence Design Systems (blog at https://eda360insider.wordpress.com/)
This entry was posted in 2.5D, 3D and tagged , , , , , . Bookmark the permalink.

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