Hot Chips 24 in August will feature a 3D tutorial plus details of new chips from AMD, Intel, Xilinx, and more

This year’s Hot Chips conference takes place on August 24-29 in a new venue: The Flint Center for the Performing Arts in Cupertino, CA. On the afternoon of August 27, there’s a die-stacking tutorial with presentations from AMD, Amkor, SK hynix, and Xilinx. The actual conference presentations take place the following two days with presentations from Intel, AMD, MIPS, Xilinx, Toshiba, and many more. Some highlights:

  • Intel will present details of the architecture and power-management scheme for its 3rd-generation Core processors and the Knights Corner “Many Integrated Core”
  • AMD will discuss the new Jaguar microprocessor and the Trinity Fusion APU
  • MIPS will discuss the previously announced microAptiv processor architecture
  • Xilinx will discuss its 3D approach to adding 28Gbps transceivers to the Virtex-7 FPGA architecture

And that’s only a small sample of the presentations.

More details and registration info here.

About sleibson2

EDA360 Evangelist and Marketing Director at Cadence Design Systems (blog at https://eda360insider.wordpress.com/)
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