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Recent Posts
- A head-to-head comparison of the ARM Cortex-M4 and –M0 processor cores by Jack Ganssle
- Friday Video: SoC in tiny 500mg backpack transforms cockroach into radio-controlled exploration vehicle
- Friday Video: A different kind of fab with some very, very cool machines
- Friday Video: Get the latest skinny on the IPC-2581 open interchange standard for PCB design
- Smartphones: Where PCIe has not gone before—but will. Sooner rather than later.
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Top Posts
- A head-to-head comparison of the ARM Cortex-M4 and –M0 processor cores by Jack Ganssle
- 3-processor SoC for digital still cameras incorporates an ARM 1136J-S RISC processor core plus separate image and video processors
- Ingenious architectural features allow ST to extract maximum performance from new microcontroller family based on ARM Cortex-M4. Cost: less than 6 bucks in 1000s
- Power, Performance, Cost. FDSOI lets you pick any three. Want proof? How about an ARM Cortex-M0 processor core example?
- Friday Video: How the iPhone saved a Corning glass factory in Harrodsburg, Kentucky
- Friday Video: Engineering humor from Don McMillan, the chip designer turned professional comedian
- 3D Thursday: Micron’s 3D Hybrid Memory Cube delivers more DRAM bandwidth at lower power and in a smaller form factor using TSVs
- 3D Thursday: Hybrid Memory Cube—Does anyone know what’s happening with IBM and Micron?
- Friday Video: Want the basics of PCB design in 45 minutes? Dave Jones delivers yet again with a free tutorial.
- Want a peek at a possible Qualcomm 3D IC roadmap?
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Category Archives: 10nm
ARM, TSMC announce collaboration on FINfet-based ARM v8 processor core for sub-20nm SoC designs
Today, ARM and TSMC announced a multi-year deal to develop a 64-bit ARM v8 processor “beyond” the 20nm node using FINfets. The collaboration includes the ARMv8 architecture, ARM Artisan physical IP, and TSMC’s FinFET process technology. The target of this … Continue reading
Posted in 10nm, 14nm, 20nm, ARM, EDA360, Silicon Realization, SoC, SoC Realization
Tagged ARM, FinFET, TSMC
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Hear IBM’s Dr. Gary Patton on the future of silicon scaling…and beyond. (Audio from The Common Technology Platform Forum keynote)
Earlier this year, Dr. Gary Patton, Vice President of IBM’s Semiconductor Research and Development Center, spoke about the future of semiconductor scaling and beyond. It was a terrific keynote speech at the Common Platform Technology Forum and was similar to … Continue reading
Posted in 10nm, 14nm, 20nm, 3D, EDA360, IBM, Silicon Realization
Tagged Common Technology Platform Forum, Gary Patton, IBM
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Scaling the peaks to look at the 14nm cliff, Part 2: Tom Beckley from Cadence explains how we’re getting to 20nm and then on to 14nm and 10nm
This week at the ISQED Symposium in Silicon Valley, Tom Beckley who is the Senior VP of R&D for Custom IC and Signoff at Cadence opened the conference with a keynote covering the industry’s challenges and progress at 20nm and … Continue reading
Posted in 10nm, 14nm, 20nm, 28nm, Design Abstraction, Design Intent, DFM, Double Patterning, EDA360, IBM, Silicon Realization
Tagged 10nm, 14nm, 20nm, 28nm, extraction, FinFET, ISQED, layout, parasitic
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3D Thursday: TSMC talks more about Moore, More than Moore, and 3D ICs at CDNLive!
Rick Cassidy, president of TSMC North America, gave a keynote speech at CDNLive! Silicon Valley this week and discussed 3D IC assembly in the context of Moore’s Law. “I think we can actually beat Moore,” he said after discussing planar … Continue reading
Posted in 10nm, 14nm, 2.5D, 3D, CDNLive!, EDA360, Packaging, Silicon Realization, SoC, SoC Realization
Tagged 2.5D, 3D, Cadence, Moore's law, TSMC
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