Category Archives: 14nm

ARM, TSMC announce collaboration on FINfet-based ARM v8 processor core for sub-20nm SoC designs

Today, ARM and TSMC announced a multi-year deal to develop a 64-bit ARM v8 processor “beyond” the 20nm node using FINfets. The collaboration includes the ARMv8 architecture, ARM Artisan physical IP, and TSMC’s FinFET process technology. The target of this … Continue reading

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Posted in 10nm, 14nm, 20nm, ARM, EDA360, Silicon Realization, SoC, SoC Realization | Tagged , , | Leave a comment

Friday Video: Luigi Capodieci, a fellow at GLOBALFOUNDRIES, talks 20nm and below, EUV, FINFETs, and the state of the foundry business

Be sure to watch this excellent 13-minute interview done by Mark LePedus starring Luigi Capodieci, a fellow with GLOBALFOUNDRIES, to get a close-up-and-personal look at the state of the foundry business (it’s not dying), 20nm design, EUV in the wings, … Continue reading

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Hear IBM’s Dr. Gary Patton on the future of silicon scaling…and beyond. (Audio from The Common Technology Platform Forum keynote)

Earlier this year, Dr. Gary Patton, Vice President of IBM’s Semiconductor Research and Development Center, spoke about the future of semiconductor scaling and beyond. It was a terrific keynote speech at the Common Platform Technology Forum and was similar to … Continue reading

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3D Thursday: My breakfast with IBM’s Gary Patton leads to a discussion of 20nm and 14nm IC design

Yesterday I moderated a panel on 2(x)nm success at DAC and one of the panelists was Dr. Gary Patton, VP of IBM’s Semiconductor Research and Development Center in East Fishkill, NY. I’ve heard Dr. Patton speak before and he knows … Continue reading

Posted in 14nm, 20nm, 28nm, Double Patterning, EDA360, EUV, Silicon Realization, SoC, SoC Realization | Tagged , , , , , , , | Leave a comment

What are the challenges of EUV lithography and the issues surrounding double patterning? CDNLive! presentation provides details.

Richard Goering has just published an excellent blog post on double patterning for 20nm and 14nm process geometries in his blog Industry Insights. The post is based on a paper presented by IBM Distinguished Engineer Lars Liebman at the recent … Continue reading

Posted in 14nm, 20nm, Double Patterning, EDA360, EUV, Silicon Realization | Tagged , , , , , , | Leave a comment

Scaling the peaks to look at the 14nm cliff, Part 2: Tom Beckley from Cadence explains how we’re getting to 20nm and then on to 14nm and 10nm

This week at the ISQED Symposium in Silicon Valley, Tom Beckley who is the Senior VP of R&D for Custom IC and Signoff at Cadence opened the conference with a keynote covering  the industry’s challenges and progress at 20nm and … Continue reading

Posted in 10nm, 14nm, 20nm, 28nm, Design Abstraction, Design Intent, DFM, Double Patterning, EDA360, IBM, Silicon Realization | Tagged , , , , , , , , | Leave a comment

Scaling the 20nm peaks to look at the 14nm cliff, Part 1: Tom Beckley from Cadence maps the challenges of advanced node design at ISQED

Yesterday at the ISQED Symposium in Silicon Valley, Tom Beckley who is the Senior VP of R&D for Custom IC and Signoff at Cadence opened the conference with a keynote that lays out the challenges for IC designers tackling advanced … Continue reading

Posted in 14nm, 20nm, EDA360, Silicon Realization, SoC, SoC Realization | Tagged , , , | 1 Comment

Want to know what’s going to happen at 20nm, 14nm, and beyond? A few answers from Frank Leu of Cadence

Last week at the Global Technology Forum held at the Santa Clara Convention Center in Silicon Valley, Cadence VP of R&D Frank Leu discussed the things we’ve learned about 20nm IC manufacturing, what we are learning about 14nm, and where … Continue reading

Posted in 14nm, 20nm, 28nm, EDA360, Globalfoundries, Samsung, Silicon Realization, SoC, SoC Realization, System Realization | Tagged , , , , , , | 2 Comments

3D Thursday: TSMC talks more about Moore, More than Moore, and 3D ICs at CDNLive!

Rick Cassidy, president of TSMC North America, gave a keynote speech at CDNLive! Silicon Valley this week and discussed 3D IC assembly in the context of Moore’s Law. “I think we can actually beat Moore,” he said after discussing planar … Continue reading

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By the numbers: 20nm (and 40nm, 32nm, 28nm, and 14nm) design to be discussed in technical detail at next week’s CDNLive! conference in Silicon Valley

There’s still time to register for CDNLive!, which is being held on March 13 and 14 at the Doubletree Hotel in San Jose, California so let me give you a few numbers to whet your appetite: 40nm, 32nm, 28nm, 20nm, … Continue reading

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Friday Video: Common Platform Technology Forum reveals program agenda, rolls into Silicon Valley on March 14

The Common Platform partners are IBM, Samsung, and GLOBALFOUNDRIES and their annual Technology Forum  rolls into Silicon Valley on March 14, so you have a couple of weeks to sign up. This short video from ChipEstimate.com gives you a good … Continue reading

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